Semiconductor Test & Packaging Leader: NPI to HVM

RECRUIT123 PTE. LTD.; Singapore; On-site; SGD 180,000 - 320,000; Full time

Job summary

RECRUIT123 PTE. LTD. is seeking an experienced Test & Packaging Engineering Leader to drive the full lifecycle for advanced semiconductor products, from NPI through HVM transfer.

You will lead a team of engineers, shape test requirements with cross-functional partners, and manage vendor relationships to ensure production readiness. The role requires strong leadership, over a decade of test/packaging experience in semiconductors, and a proven track record in NPI and cost-of-test improvements.

Qualifications

• 10+ years in test/packaging in semiconductor industry
• 5+ years in a managerial/leadership role
• Proven track record in NPI, test solution development, and HVM transfer
• Strong understanding of advanced packaging and test processes (wafer-level/final test, wire bonding)
• Experience managing tester RFQ processes and vendor negotiations
• Strong project management, cross-functional collaboration, and stakeholder management
• Excellent leadership and people management capabilities

Responsibilities

• Lead the NPI effort to develop in-house test solutions and manage tester RFQ process
• Own transfer of qualified test solutions into High Volume Manufacturing with production readiness
• Define test requirements and specifications with design, process, and packaging teams
• Evaluate, select, and manage test equipment vendors and suppliers
• Drive test yield improvement and cost-of-test reduction initiatives
• Establish test methodologies, standards, and documentation for scale-up and transfer
• Manage timelines, budgets, and resources for test development programs
• Lead and develop a team of test and packaging engineers
• Collaborate with R&D, operations, quality, and supply chain on milestones
• Provide technical guidance on packaging/test integration for advanced semiconductor devices

Skills

Leadership

Test & Packaging Eng

NPI

Cross-functional

Vendor management

Project management

Education

Electrical Eng (BSc/MSc)

Materials Science

Job description

RECRUIT123 PTE. LTD. is seeking an experienced Test & Packaging Engineering Leader to drive the full lifecycle for advanced semiconductor products, from NPI through HVM transfer.

You will lead a team of engineers, shape test requirements with cross-functional partners, and manage vendor relationships to ensure production readiness. The role requires strong leadership, over a decade of test/packaging experience in semiconductors, and a proven track record in NPI and cost-of-test improvements.