Technical Program Manager (TPM)

ACCTON TECHNOLOGY SG PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

ACCTON TECHNOLOGY SG PTE. LTD. is seeking a Technical Program Manager to lead multi-disciplinary engineering programs for optical transceivers and datacom product lines within the manufacturing facility.

You will drive New Product Introduction, factory bring-up, cross-functional execution, process optimization, and risk mitigation from prototype stages through high-volume production. The role requires strong technical grounding in optical assembly processes and the ability to guide

Qualifications

• Bachelor's degree or above in a technical discipline relevant to optical engineering/manufacturing
• 7+ years in technical program management or engineering leadership in optical/pluggable products
• Proven NPI experience and factory bring-up in high-volume manufacturing environments
• Strong knowledge of optical transceiver assembly processes and manufacturing flows
• Experience with QC, process control, ECOs/ECNs, and SP C methods

Responsibilities

• Lead lifecycle for new optical transceivers and datacom products from prototype to high-volume manufacturing
• Coordinate milestones between design, process engineering and production teams
• Mitigate cross-functional risks impacting production timelines and yields
• Define and improve engineering development processes, metrics, and governance
• Maintain program dashboards and communicate risks and resource needs to leadership
• Oversee qualification cycles aligning with industry standards and quality governance

Skills

Technical program management

Optical engineering

NPI

Cross-functional leadership

Manufacturing process knowledge

Education

Bachelor's degree in Optical/Electrical/Mechanical Engineering

Tools

Gantt charts

Excel

PowerPoint

Job description

About the role

The Technical Program Manager (TPM) is responsible for leading, coordinating, and executing multi-disciplinary engineering programs for optical transceiver and datacom product lines within the manufacturing facility. This role focuses on driving New Product Introduction (NPI), factory bring-up activities, cross-functional execution, process optimization, and technical risk mitigation from prototype stages through to high-volume manufacturing. A strong technical grounding in core optical assembly processes is essential to effectively guide cross-functional teams and resolve factory bottlenecks.

Key responsibilities

• Lead the technical program lifecycle for introducing new optical transceivers and datacom products into the manufacturing facility, coordinating milestones between product design, process engineering, and production teams from prototype to high-volume manufacturing (HVM)

• Leverage a deep working knowledge of critical transceiver packaging processes—including Die Bonding, Wire Bonding, and Active Alignment—to partner directly with engineering teams, translate technical specs into robust manufacturing flows, and ensure seamless NPI handoffs to the factory floor

• Proactively track and mitigate cross-functional risks impacting production timelines, such as component shortages (lasers, photodetectors, ICs) or equipment delays, collaborating with quality and engineering teams to address technical bottlenecks, improve first-pass yield (FPY), and drive root-cause analysis on manufacturing failures

• Define, implement, and continuously improve engineering development processes, communication frameworks, and metrics tracking (e.g., velocity, quality, capacity, manufacturing yield), championing operational excellence through standardization across all participating design, test, and production teams

• Manage cross-team dependencies, facilitate technical trade-off decisions under constraint, and maintain program dashboards to communicate timeline progress, critical risks, and resource requirements to executive leadership

• Oversee qualification cycles, ensuring alignment with industry standards (e.g., Telcordia, MSA specifications) while maintaining compliance with quality, safety, and operational governance standards across the factory floor

About you

• Bachelor's degree or above in Optical Engineering, Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, or a related technical discipline

• 7+ years of experience in technical program management, engineering management, or technical project leadership in optical transceiver, datacom, or optoelectronics manufacturing environments

• Proven track record of managing NPI, product transfers, or factory bring-up initiatives in high-volume manufacturing environments

• In-depth understanding of core optical transceiver assembly processes, specifically Die Bonding, Wire Bonding, and Active Alignment, including their impact on device performance, yield, and throughput

• Strong understanding of optical transceiver manufacturing processes, hardware validation, optical/electrical testing, and packaging workflows

• Ability to translate complex optical, electrical, and firmware specifications into actionable manufacturing requirements and production milestones

• Deep knowledge of New Product Introduction (NPI) frameworks, phase-gate development methodologies, and engineering change management (ECOs/ECNs)

• Familiarity with qualification standards, manufacturing quality frameworks, statistical process control (SPC), and root cause analysis methodologies (DOE, FMEA, PFMEA, CAPA)

• Strong capability in dependency mapping, risk management, and resource allocation across hardware, software, and test engineering disciplines

• Exceptional cross-functional leadership, communication, and stakeholder management abilities with strong analytical, data-driven decision-making, and problem-solving skills

• Proficient in project management tools, Gantt charts, Microsoft Excel and Power Point

• Ability to drive executive and maintain alignment in a fast-paced, high-tech manufacturing environment