Staff Process Integration Engineer

UNITED MICROELECTRONICS CORPORATION (SINGAPORE BRANCH)

Singapore

On-site

SGD 85,000 - 120,000

Full time

5 days ago
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Job summary

UNITED MICROELECTRONICS CORPORATION (SINGAPORE BRANCH) is seeking a Process Integration Engineer to ensure stable wafer quality and on-time delivery through robust process integration and daily management. The role supports production ramp and new product tape-outs, coordinating with module engineers to resolve inline and yield issues.

The ideal candidate has a Bachelor's degree in a relevant engineering discipline, excellent communication and time-management skills, and at least 6 years in

Qualifications

  • Bachelor's degree in Electronic Engineering, Electrical/Electronic Engineering or Physics.
  • Strong communication skills.
  • Strong time management and commitment.

Responsibilities

  • Introduce customer's product to FAB and support tape-out procedures for pilot success.
  • Improve product yield and ensure mass production inline, WAT and CP yield stability.
  • Define standard operating procedures for daily tasks.
  • Coordinate with module engineers to resolve production-related issues (inline, WAT, yield, reliability).
  • Develop customized processes to meet customer requirements.

Skills

Communication skills
Time management
Commitment

Education

Bachelor's Degree in Electronic Engineering, Electrical Electronic Engineering, Physics

Job description

Job Overview

Are you curious about the advancement of technology that enable millions of devices to be created on a single silicon chip the size of your finger? Are you pursuing to become a wafer fabrication expert in a fully integrated process chain? Look no further as UMC Process Integration Engineer position is the perfect fit for you.

UMC Singapore is expanding its production capacity and will build the first 22-nanometer production line in 'Garden City' Singapore. We are looking for Process Integration Engineer to maintain customer production by ensuring stable wafer quality and on-time wafer delivery through process integration and daily management. This position provides excellent opportunities for growth and development.

Responsibilities

  • Introduce customer's new product to FAB and support in new product's tape out procedures to ensure pilot success.
  • Improve new Product yield and ensure mass production inline, WAT and CP yield stable
  • Define standard operation procedure for daily job
  • Co-work with module engineers to solve production related issues. (inline, WAT, yield and reliability...)
  • Co-work with module engineers to develop customized process to meet customer special requirement

Qualifications

  • Minimum requirement of at least a Bachelor's Degree in Electronic Engineering , Electrical Electronic Engineering, Physics
  • Possess good communication skills
  • Possess good time management skills as well as a strong sense of commitment
  • At least6years of semiconductor foundry process engineer / process integration background with3years of 22/28 and below nanometer experience is required
  • Possess 22/28 nanometer tape out and NTO pilot experience
  • Possess good ability to coordinate cross department task and drive related parties to achieve task force goal on time
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