Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. is seeking an Advanced Packaging Metrology-RDA Engineer to drive metrology and AI-enabled insights for advanced packaging technologies.

You will develop and optimize metrology recipes, validate inline results, and coordinate with multiple teams to integrate new tech into production. The role emphasizes data-driven decision making, defect analysis, and maintaining tool performance while applying AI literacy to daily work.

Qualifications

• PhD or Master/Bachelor with relevant experience in Electrical Eng., Materials Science, Chemical Eng., Physics, or related field.
• Semiconductor process or equipment engineering experience, preferably wafer bonding, plating, warpage control and packaging.
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC, and RMS for equipment and process control.

Responsibilities

• Develop and optimize metrology recipes for various semiconductor processes.
• Ensure that the recipes are accurate and efficient for production needs.
• Develop and execute strategies for process monitoring, sampling, and CIP.
• Establish inspection methodologies and best-known methods (BKM) for metrology processes.
• Perform in-line characterization and validation of metrology recipes.
• Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress.
• Continuously analyze data to identify improvement opportunities and ensure process efficiency.
• Own and manage metrology tools, ensuring they meet performance indicators and quality standards.
• Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts.
• Engage in early involvement with APTD to ensure seamless integration of new technologies.
• Work closely with various teams, including Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control.
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within ones scope of work.

Skills

Python

R

SQL

Data analytics

Statistical analysis

DOE

Dashboarding

Cross-functional collaboration

Education

PhD with ≥2 years

Master’s degree with ≥5 years

Bachelor’s degree with ≥7 years

Tools

E3

FDC

RMS

Power BI

Job description

Role Summary:

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new metrology and RDA technologies for solutions that drive the future. Additional responsibilities include establishing equipment evaluation and long-range strategy to enable advanced packaging technology roadmap.

Main Responsibilities:

Recipe Development and Optimization:

• Develop and optimize metrology recipes for various semiconductor processes

• Ensure that the recipes are accurate and efficient for production needs

• Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)

Inspection and Characterization:

• Establish inspection methodologies and best-known methods (BKM) for metrology processes

• Perform in-line characterization and validation of metrology recipes

Data Analysis and Reporting:

• Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress

• Continuously analyze data to identify improvement opportunities and ensure process efficiency

Quality and Performance Indicators:

• Own and manage metrology tools, ensuring they meet performance indicators and quality standards

• Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts

Collaboration and Coordination:

• Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologies

• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control

AI Responsibilities:

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Required Qualifications:

• PhD with ≥2 years Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.

• Semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field.

Must Have Technical Skills:

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.

• Experience with Visual Basic for automation and tool integration.

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability

• Hands on experience with wafer/assembly tools or metrology/RDA systems

Must Have Soft Skills:

• Strong analytical and problem-solving capabilities.

• Outstanding communication, leadership, and stakeholder management skills.

• Ability to work independently and collaboratively in a fast-paced environment.

• Ability to work cross-functionally with process, equipment, and reliability teams.

AI Requirements:

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Embody Micron’s core values:

• People – Respect, develop, and empower others

• Innovation – Drive continuous improvement and breakthrough thinking

• Tenacity – Show grit and determination

• Collaboration – Build trust and foster teamwork

• Customer Focus – Deliver excellence and value

• Speed – Act with purpose and set the pace