Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis

Micron Technology, Inc

Singapore

On-site

SGD 120,000 - 180,000

Full time

6 days ago
Be an early applicant
Application generator

A complete application in a minute — tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

Micron Technology, Inc. is seeking an Advanced Packaging Metrology-RDA Engineer to join the Advanced Packaging Technology Development team in Singapore. You will develop and optimize metrology recipes for semiconductor processes and drive yield improvements through data-driven insight.

You will collaborate with cross-functional teams to deploy AI-assisted tools, establish SPC controls, and validate metrology methods while ensuring production quality and alignment with the technology roadmap.

Qualifications

  • PhD/Master/Bachelor in a relevant field with process or equipment experience.

Responsibilities

  • Develop and optimize metrology recipes for semiconductor processes.
  • Ensure recipes are accurate and efficient for production needs.
  • Develop and execute strategies for process monitoring, sampling, and CIP.
  • Establish inspection methodologies and BKM for metrology processes.
  • Perform in-line characterization and validation of metrology recipes.
  • Utilize data analysis tools to summarize metrology progress and reports.
  • Own metrology tools, ensuring performance and quality standards.
  • Drive OCAP/ SPC charts and readiness for manufacturing.
  • Collaborate with Package Integration, PWF/Assembly Eng, Front End, and Quality teams.
  • Apply AI-assisted tools to improve efficiency and outcomes.

Skills

Python
R
SQL
Visual Basic
E3
FDC
RMS
Data analytics
DOE
Dashboarding
Wafer tooling

Education

PhD in Electrical Engineering
Master’s degree in Electrical Engineering
Bachelor’s degree in Electrical Engineering

Tools

Power BI

Job description

Our vision is to transform how the world uses information to enrich life for all.Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.Role Summary:We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team!Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new metrology and RDA technologies for solutions that drive the future. Additional responsibilities include establishing equipment evaluation and long-range strategy to enable advanced packaging technology roadmap.Main Responsibilities:Recipe Development and Optimization:Develop and optimize metrology recipes for various semiconductor processesEnsure that the recipes are accurate and efficient for production needsDevelop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)Inspection and Characterization:Establish inspection methodologies and best-known methods (BKM) for metrology processesPerform in-line characterization and validation of metrology recipesData Analysis and Reporting:Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progressContinuously analyze data to identify improvement opportunities and ensure process efficiencyQuality and Performance Indicators:Own and manage metrology tools, ensuring they meet performance indicators and quality standardsDrive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) chartsCollaboration and Coordination:Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologiesWork closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality controlAI Responsibilities:Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.Candidate ProfileMinimum Required Qualifications:PhD with 2 years Master’s degree with 5 years, or Bachelor’s degree with 7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.Semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field .Must Have Technical Skills:Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.Experience with Visual Basic for automation and tool integration.Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliabilityHands on experience with wafer/assembly tools or metrology/RDA systemsMust Have Soft Skills:Strong analytical and problem-solving capabilities.Outstanding communication, leadership, and stakeholder management skills.Ability to work independently and collaboratively in a fast-paced environment.Ability to work cross-functionally with process, equipment, and reliability teams.AI Requirements:Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.Embody Micron’s core values:People – Respect, develop, and empower othersInnovation – Drive continuous improvement and breakthrough thinkingTenacity – Show grit and determinationCollaboration – Build trust and foster teamworkCustomer Focus – Deliver excellence and valueSpeed – Act with purpose and set the paceAbout Micron Technology, Inc.We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careersAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.comMicron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis
Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis

Micron • Singapore

On-site
SGD 150,000 - 210,000
Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA) Singapor[...]
Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA) Singapor[...]

Micron Memory Malaysia Sdn Bhd • Singapore

On-site
SGD 120,000 - 180,000
Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis
Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis

Micron Technology • Singapore

On-site
SGD 90,000 - 130,000
Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis
Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD • Singapore

On-site
SGD 120,000 - 180,000
Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)
Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

Micron • Singapore

On-site
SGD 90,000 - 120,000
Staff/Principal Engineer, APTD CEM - Advanced Packaging Integration Engineering
Staff/Principal Engineer, APTD CEM - Advanced Packaging Integration Engineering

Micron • Singapore

On-site
SGD 120,000 - 180,000
Staff/Principal Engineer, APTD CEM - Advanced Packaging Integration Engineering
Staff/Principal Engineer, APTD CEM - Advanced Packaging Integration Engineering

Micron Technology • Singapore

On-site
SGD 120,000 - 180,000
Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering Singapore, Singapore Posted a day ago
Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering Singapore, Singapore Posted a day ago

Micron Technology, Inc • Singapore

Hybrid
SGD 120,000 - 180,000
Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Micron • Singapore

On-site
SGD 120,000 - 180,000
Shift Engineer, Metro Real-time Defect Analysis Singapore, Singapore Posted 7 hours ago
Shift Engineer, Metro Real-time Defect Analysis Singapore, Singapore Posted 7 hours ago

Micron Technology, Inc • Singapore

Hybrid
SGD 50,000 - 73,000