PDE PIE (Package Integration Engineering) Senior Engineer/Engineer

Micron Technology, Inc; Singapore; On-site; SGD 100,000 - 130,000; Full time

Job summary

Micron Technology, Inc in Singapore seeks an experienced Product Owner to lead new product introduction efforts. This role involves collaborating with cross-functional teams to meet business objectives and manage product lifecycle from NPI to end-of-life.

The ideal candidate will have at least 8 years of experience in the semiconductor industry, with strong packaging knowledge and a background in engineering. Micron offers an inclusive workplace and provides opportunities for qualified applicants.

Qualifications

• Master's or Bachelor's degree in relevant engineering discipline.
• 8+ years in MNC semiconductor for mobile and automotive.
• Strong knowledge in backend engineering and packaging.

Responsibilities

• Lead and manage new product introduction activities.
• Drive NPI process through phase-gate reviews.
• Monitor product yield trends and reliability.

Skills

Packaging knowledge

Data analysis

Technical knowledge in module manufacturing

Knowledge of AI-assisted tools

Education

Master’s or Bachelor’s degree in Mechanical, Material, Chemical or related Engineering

Tools

JMP analysis

Job description

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence.

Responsibilities

• Lead and manage new product introduction (NPI) activities as a Product Owner, collaborating with cross‑functional teams to achieve business objectives.
• Drive the NPI process through phase‑gate reviews and coordinate product start‑up to achieve first‑pass qualification.
• Communicate new product timelines, applications and customer requirements to the start‑up team.
• Work with process, equipment, manufacturing and planning owners to transition products and packages into high‑volume production.
• Provide timely support for first silicon, engineering samples, qualification samples and meet engineering hot lot cycle time expectations per the project schedule.
• Monitor product yield trends and reliability; initiate early corrective action as needed.
• Own the entire product lifecycle from NPI through end‑of‑life (EOL).
• Collaborate with process, equipment and development owners to develop new technology capabilities ahead of market.
• Act as a primary point of contact for TPM on product‑related matters.

Requirements

• Master’s or Bachelor’s degree in Mechanical, Material, Chemical or related Engineering.
• Minimum 8 years of experience in an MNC semiconductor environment for mobile and automotive business.
• Strong packaging knowledge in backend engineering process or package development.
• Good technical knowledge in component test and/or module manufacturing process.
• Familiarity with package structures (e.g., BGA, PoP) and package reliability concepts.
• Excellent data analysis, statistical analysis and data interpretation skills; proficiency in JMP analysis is a must.
• Ability to make sound data‑driven decisions and prioritize tasks with due diligence.
• Experience using AI‑assisted tools to accelerate root‑cause screening, DOE design and automated reporting.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.