Sr. Staff Signal Integrity Engineer (SI / PI)

OMNIVISION TECHNOLOGIES SINGAPORE PTE. LTD.; Singapore; Sur place; SGD 180 000 - 240 000; Plein temps

Résumé du poste

OMNIVISION TECHNOLOGIES SINGAPORE PTE. LTD. is seeking a Sr. Staff Signal Integrity Engineer to drive SI/PI signoffs for chip, package and PCB designs across global teams. You will model high-speed I/O and PDN, and assist customers with PCB signoff and issue debugging.

The role emphasizes defining electrical performance specifications and may include EMC modeling and simulation work. Strong collaboration and advanced degrees are required.

Qualifications

• 10+ years of working experience in SI/PI.
• Deep understanding of electromagnetic, transmission line and microwave theory.
• Familiar with SI/PI design flow, time domain and frequency domain modeling and simulation.
• Good comprehension of PLL, equalization, CDR, jitter, noise, IBIS modeling and 8b/10b encoding.
• Hands-on experience with high-end lab equipment (oscilloscope, spectrum analyzer, network analyzer).
• Skilled in SI/PI simulation tools from ANSYS, Cadence, Keysight and others.
• Scripting in Python or Matlab for data processing.
• Experience in MIPI D-PHY, C-PHY and PAM-4 is a plus.
• Strong communication and teamwork skills.
• MS/PhD degree.

Responsabilités

• Primary (70%): SI/PI signoff of chip, package and PCB design; model high-speed I/O and PDN; support PCB signoff issues.
• Secondary (30%): Define electrical specs for high-speed I/O; model and simulate EMC issues.

Connaissances

SI/PI engineering

Electromagnetic theory

Transmission line theory

Microwave theory

SI/PI design flow

Time-domain modeling

Frequency-domain modeling

IBIS modeling

Jitter & noise analysis

PLL/CDR/Equalization

Lab equipment operation

Python/ Matlab scripting

MIPI D-PHY / C-PHY / PAM-4

Communication & team work

Formation

MS/PhD

Outils

ANSYS

Cadence

Keysight

Description du poste

Position Overview:

As a Sr. Staff signal integrity engineer, you will be working on challenging SI and PI tasks in globally distributed teams. You will be supporting SI/PI signoff of chip design, package design and PCB design in order to support successful delivery of products of various product lines to market. You will be working with design, test, P&R and application teams globally for modeling of chip high speed I/O and power rails. You will be supporting customers in signing off hardware design or resolving SI/PI issues where system design has constraints. You will also be involved in defining specifications of product electrical performance. You may also be involved in modeling and simulation of EMC issues.

Responsibilities:

Primary (70%):

• Responsible for SI/PI signoff of chip design, package design and PCB design.


• Responsible for modeling high speed I/O and PDN.


• Responsible for customer support for PCB design signoff and issue debug.

Secondary (30%):

• Responsible for product electrical specifications related to high speed I/O.


• Responsible for modeling and simulation of EMC issues.

Requirements:

• 10+ years of working experience in SI/PI


• Deep understanding of electromagnetic theory, transmission line theory and microwave theory


• Familiar with SI/PI design flow, time domain and frequency domain modeling and simulation


• Good comprehension of PLL, equalization, CDR, jitter, noise, IBIS modeling, 8b10b encoding


• Hands on experience with lab equipment such as the high speed oscilloscope, spectrum analyzer and network analyzer


• Skilled with SI/PI simulation tools from ANSYS, Cadence, Keysight and others.


• Skilled in data processing with script in Python, Matlab or other languages.


• Experience in MIPI D-PHY, C-PHY and PAM-4 is a plus.


• Good communication skills and team work.


• MS/PhD