Software Engineer (Semicon, MNC)

RRECRUITER INT PTE. LTD.

Singapore

On-site

SGD 60,000 - 90,000

Full time

13 days ago
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Job summary

RRECRUITER INT PTE. LTD. in Singapore is seeking a engineers to design and develop machine control systems for die and wire bonding equipment. You will work on software/hardware integration and document qualifications.

The role requires a degree in Electronics/Electrical/Mechatronics and strong programming skills (Visual C++, C#, VB.NET). You will analyze customer requirements, lead technical tasks, and collaborate across teams to meet timelines and quality standards.

Qualifications

  • Degree required in electronics/electrical/mechatronics engineering with Second Upper or higher.
  • Strong software programming and electronics design experience.
  • Knowledge of semiconductor processes is essential.
  • Ability to lead, analyze problems, and work independently or in teams.

Responsibilities

  • Design and develop machine control systems for die and wire bonding equipment.
  • Perform software-hardware integration, testing, qualification, and documentation.
  • Analyze customer requirements and develop suitable solutions and modifications.
  • Provide technical support and troubleshooting for customers.
  • Define software development processes and engineering standards.
  • Plan and manage technical projects to meet quality and timeline requirements.
  • Develop engineering documentation, SOPs, and guidelines.

Skills

Software programming
Electrical design
Mechatronics understanding
Semiconductor process knowledge
Leadership
Analytical skills
Problem solving
Teamwork

Education

Degree in Electronics/Electrical/Mechatronics Engineering (Second Upper or above)

Tools

Visual C++
C#
VB.NET

Job description

Key Responsibilities
  • Design and develop machine control systems, software, and hardware for die and wire bonding equipment.
  • Perform software-hardware integration, testing, qualification, and documentation.
  • Analyze customer requirements and develop suitable solutions and modifications.
  • Provide technical support and troubleshooting for customers.
  • Define software development processes and engineering standards.
  • Plan and manage technical projects to meet quality and timeline requirements.
  • Develop engineering documentation, SOPs, and guidelines.
Job Requirements
  • Degree in Electronics, Electrical, or Mechatronics Engineering (Second Upper or above).
  • Strong in software programming and electrical/electronics design for die and wire bonding machines.
  • Proficient in Visual C++, C#, and VB.NET.
  • Strong semiconductor process knowledge.
  • Excellent technical leadership, analytical, and problem-solving skills.
  • Self-motivated, innovative, and able to work independently and in teams.
  • Willing to learn and take on new challenges.
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