Silicon Product Integration

Hewlett Packard Co.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Hewlett Packard Co. is seeking an experienced Product Engineer to lead silicon product engineering, foundry engagement, and NPI execution for next-generation MEMS programs.

You will bridge HP, foundries, design, manufacturing, and global program teams to ensure technology development, qualification, and high-volume manufacturing readiness. The role requires 8+ years in semiconductor engineering, strong program management, and proven cross-functional leadership.

Qualifications

• 8+ years semiconductor industry experience.
• Experience working directly with semiconductor foundries.
• Strong background in product engineering, yield, process integration, device engineering, failure analysis, and semiconductor manufacturing.

Responsibilities

• Own silicon product engineering activities across development, qualification, ramp, and sustaining phases.
• Drive cost-saving initiatives in wafer foundries and advanced packaging factories.
• Lead NPI silicon builds and ensure timely delivers from wafer and packaging partners.
• Collaborate with design, architecture, reliability, systems, and manufacturing teams to resolve technical issues.
• Manage cross-functional programs across global teams and drive risk mitigation and milestones.

Skills

Product Engineering

Yield Engineering

Process Integration

Device Engineering

Failure Analysis

Semiconductor Manufacturing

Cross-functional Leadership

Program Management

Stakeholder Management

Education

Electrical Engineering

Mechanical Engineering

Materials Science

Semiconductor Engineering

Physics

Job description

Silicon Product Integration**Description -** **Role Overview**We are seeking an experienced Product Engineer to lead silicon product engineering, foundry engagement, and NPI execution for next-generation MEMS programs. The role serves as the technical bridge between HP, foundry partners, design teams, manufacturing organizations, and worldwide program teams to ensure successful technology development, qualification, and high-volume manufacturing readiness.The successful candidate will combine deep semiconductor foundry experience with strong program leadership skills to drive product execution from technology development through qualification and production launch. **Key Responsibilities****Product Engineering Leadership*** Own silicon product engineering activities across development, qualification, ramp, and sustaining phases.* Drive structural cost saving initiative in wafer Foundry and advanced packaging factories.* Lead NPI silicon builds and ensure timely execution of wafer, and advanced packaging factories deliverables.* Partner with design, architecture, reliability, systems, and manufacturing teams to close technical issues.* Drive issue resolution and technical solution for the process marginality and escalation.**Foundry and Technology Development*** Serve as the primary technical interface with internal/external foundries and technology partners.* Drive technical reviews, process optimization, design enablement, and qualification activities.* Lead root-cause investigations and corrective actions related to yield, reliability, and manufacturability.* Assess technology options and recommend development strategies for future products.**Program and NPI Leadership*** Program Management Leadership cross-functional execution for strategic MEMS programs.* Develop and manage technical schedules, milestones, dependencies, and risk mitigation plans.* Coordinate worldwide teams across design, process, integration, manufacturing, supply chain, and program management.* Drive technical decision-making through product design cycles and qualification checkpoints.**Required Qualifications*** Bachelor's, Master's, or PhD in: + Electrical Engineering + Mechanical Engineering + Materials Science + Semiconductor Engineering + Physics + Related technical disciplines* 8+ years semiconductor industry experience.* Experience working directly with semiconductor foundries.* Strong background in: + Product Engineering + Yield Engineering + Process Integration + Device Engineering + Failure Analysis + Semiconductor Manufacturing* Experience leading cross-functional development programs.* Demonstrated ability to drive technical decisions across multiple organizations.* Strong communication and stakeholder management skills.**Preferred Experience*** MEMS development experience.* NPI and high-volume manufacturing launch experience.* Experience working with internal/external wafer foundry manufacturing partners.* Program management experience for complex technical programs.**Success Profile**The ideal candidate can:* Translate complex technical challenges into executable plans.* Effectively influence across design, manufacturing, and program organizations.* Operate comfortably with both deep technical details and executive-level discussions.* Build strong partnerships with foundries and external technology providers.* Balance technical rigor, schedule execution, and business priorities.* Develop the next generation of engineering capability within HP. HP is a Human Capital Partner – we commit to human capital development and adopting progressive workplace practices in Singapore.#LI-POST**Job -**Engineering**Schedule -**Full time**Shift -**No shift premium (Singapore)**Travel -**25%**Relocation -**No**Equal Opportunity Employer (EEO) -**HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).