Senior MEMS Silicon NPI & Foundry Lead

HP

Singapore

On-site

SGD 120,000 - 190,000

Full time

3 days ago
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Benefits offered by this job

Travel - 25%

Job summary

HP is seeking an experienced Product Engineer to lead silicon product engineering, foundry engagement, and NPI execution for next-generation MEMS programs in Singapore. You will bridge HP with foundries, design teams, and manufacturing to ensure technology development, qualification, and high-volume manufacturing readiness.

The role requires 8+ years in semiconductors and strong program leadership, with a track record in cross-functional collaboration and resolving complex technical challenges.

Qualifications

  • Bachelor's, Master's, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Semiconductor Engineering or related technical disciplines.
  • 8+ years semiconductor industry experience with direct foundry engagement.
  • Strong communication and stakeholder management with cross-functional leadership.

Responsibilities

  • Lead silicon product engineering across development, qualification, ramp, and sustaining phases.
  • Drive NPI silicon builds and ensure timely execution with wafer and packaging factories.
  • Coordinate worldwide teams across design, process, integration, manufacturing, supply chain, and program management.

Skills

Semiconductor experience
Foundry engagement
Program leadership
Cross-functional collaboration

Education

Bachelor's degree in Electrical/Mechanical/Materials/Semiconductor Engineering
Master's or PhD preferred

Job description

HP is seeking an experienced Product Engineer to lead silicon product engineering, foundry engagement, and NPI execution for next-generation MEMS programs in Singapore. You will bridge HP with foundries, design teams, and manufacturing to ensure technology development, qualification, and high-volume manufacturing readiness.

The role requires 8+ years in semiconductors and strong program leadership, with a track record in cross-functional collaboration and resolving complex technical challenges.

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