Senior SI/PI Engineer for High-Speed ASICs & Systems

Bitdeer Technologies Group

Singapore

Sur place

SGD 120 000 - 180 000

Plein temps

Il y a 8 jours

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Avantages offerts par ce poste

Training and mentoring
Open workspaces
Career growth opportunities

Résumé du poste

Bitdeer Technologies Group, headquartered in Singapore, seeks a SI/PI specialist to optimize signal and power integrity across chip, package, and system levels. You will work with chip, package, and board teams to improve floor planning, interconnects, and inter-die performance, and develop robust SI/PI design guidelines.

The role requires hands-on modeling, verification, and sign-off for high-speed interfaces, plus building simulation libraries and workflows.

Qualifications

  • Degree in Microelectronics, Telecommunications, Electromagnetics, Microwave Engineering, Physics, or related field.
  • Strong theoretical foundation in SI and PI fundamentals.
  • Experience with at least one mainstream SI/PI tool.

Responsabilités

  • Analyze and optimize Signal Integrity and Power Integrity across chip, package, and system levels.
  • Collaborate with chip, package, and board design teams to optimize floor planning and interconnects.
  • Conduct modeling, analysis, verification of SI/PI, and sign-off for high-speed interfaces.
  • Establish and deliver SI/PI design guidelines and rules.
  • Build and maintain simulation libraries, model libraries, simulation environments, SI/PI methodologies, and workflows.
  • Correlate SI/PI simulation results with lab measurements and collaborate on cross-functional debugging.

Connaissances

Signal Integrity
Power Integrity
High-speed design
Cross-functional teamwork

Formation

Degree in Microelectronics, Telecommunications, Electromagnetics, Microwave Engineering, Physics, or related field

Outils

ANSYS Electronics Desktop (EDT/HFSS)
HSPICE
Keysight ADS
Cadence Sigrity

Description du poste

Bitdeer Technologies Group, headquartered in Singapore, seeks a SI/PI specialist to optimize signal and power integrity across chip, package, and system levels. You will work with chip, package, and board teams to improve floor planning, interconnects, and inter-die performance, and develop robust SI/PI design guidelines.

The role requires hands-on modeling, verification, and sign-off for high-speed interfaces, plus building simulation libraries and workflows.

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