Senior Semiconductor Process & Integration Engineer

SYSTEMS ON SILICON MANUFACTURING COMPANY PTE LTD; Singapore; On-site; SGD 150,000 - 190,000; Full time

Job summary

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.) is a joint venture between NXP and TSMC.

We are seeking a Principal Engineer for the Integration and Technology Development, HV Development department to lead cross-functional teams in process development and seamless production transfer. The role focuses on developing, transferring, and qualifying new and derivative processes, performing DOE, and resolving complex process issues across HV, BCD, RF, NV, BiCMOS and eFlash devices.

Qualifications

• Minimum 5 years working in a semiconductor manufacturing industry with experience in device/process development or integration.
• Good knowledge in semiconductor device physics and CMOS fabrication.

Responsibilities

• Develop, transfer and qualify new and derivative processes and ensure seamless transfer to Production.
• Lead cross functional teams to resolve process issues during development and transfer.
• Run design of experiments (DOE) to optimize process integration and define process specs.
• Address EFMEA-based window checks and resolve all process integration issues.
• Improve inline and electrical test (ET) parameters and yield via test vehicles.
• Identify and fix ET-related problems affecting production.

Skills

Interpersonal skills

Cross-functional collaboration

Problem solving

Education

Master's degree in semiconductor/electronics/ electrical/ physics/ material engineering

PhD is preferable

Job description

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.) is a joint venture between NXP and TSMC.

We are seeking a Principal Engineer for the Integration and Technology Development, HV Development department to lead cross-functional teams in process development and seamless production transfer. The role focuses on developing, transferring, and qualifying new and derivative processes, performing DOE, and resolving complex process issues across HV, BCD, RF, NV, BiCMOS and eFlash devices.