Senior Scientist I - Co-Packaged Optics & Interconnects

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

A*STAR RESEARCH ENTITIES in Singapore seeks an engineer to develop package level optical interconnects for advanced CPO platforms, interfacing with various optical coupling schemes.

You will simulate the impact of hybrid bonding interfaces, design lenses for optical IOs in wafer scale integration, and estimate optical losses between grating/edge couplers and fiber interfaces. This role emphasizes innovation in photonic packaging and high-density coupling.

Qualifications

• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber to chip coupling.
• Understanding of optical loss mechanisms and packaging induced misalignments.
• Knowledge of wafer level processes such as lithography, DRIE, plasma etching, wafer bonding and dicing.
• Familiarity with photonic packaging platforms such as SiPh, InP and TFLN.
• Proficiency in microscope based alignment metrology and optical loss measurements.
• Strong communication, teamwork and technical reporting skills.
• MS or PhD in Engineering Physics or a related field.

Responsibilities

• Develop package level optical interconnects for CPO platforms interfacing with optical coupling schemes.
• Simulate impact of hybrid bonding interfaces and packaging on signal transmission.
• Design lenses for optical IOs in wafer scale integration.
• Estimate optical losses between grating and edge couplers and fiber interfaces.
• Design package and wafer level interconnects for GPU-to-GPU and memory integration.
• Develop passive fiber alignment structures and techniques for high density optical coupling.
• Evaluate fiber array assemblies with CPO test vehicles.
• Generate package design and test plans to prototype processes.
• Characterize fabricated structures using optical testing and metrology tools.
• Propose innovative ideas to advance optical interconnects and testing.

Skills

Optical interconnect modeling

Fiber-to-chip alignment techniques

Optical loss measurement

Wafer-level processes understanding

Photonic packaging platforms (SiPh/InP

Microscope-based alignment metrology

Teamwork and communication

Technical reporting

Education

MS or PhD in Engineering Physics or related field

Tools

Wafer bonding

Lithography

DRIE

Plasma etching

Dicing

Job description

A*STAR RESEARCH ENTITIES in Singapore seeks an engineer to develop package level optical interconnects for advanced CPO platforms, interfacing with various optical coupling schemes.

You will simulate the impact of hybrid bonding interfaces, design lenses for optical IOs in wafer scale integration, and estimate optical losses between grating/edge couplers and fiber interfaces. This role emphasizes innovation in photonic packaging and high-density coupling.