Senior Scientist, Hybrid Bonding & Heterogeneous Packaging

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 100,000 - 160,000; Full time

Job summary

A*STAR-IME in Singapore is seeking a Senior Scientist to lead the development and optimization of hybrid bonding technologies for next-generation semiconductor, photonics, AI, and HPC applications. The role focuses on Cu/SiO₂ hybrid bonding, wafer-level or chip-level bonding processes, reliability assessment, and advanced materials characterization.

You will work with research scientists, industry partners, equipment vendors, and customers to develop innovative solutions for future heterogeneous

Qualifications

• PhD in a relevant engineering or physical science field.
• Minimum 5 years hands-on experience in hybrid bonding, wafer bonding or related packaging processes.
• Experience in heterogeneous integration and collaboration with industry partners.

Responsibilities

• Develop and optimize hybrid bonding processes for semiconductor and photonic applications.
• Lead process integration, characterization and reliability evaluation.
• Perform defect analysis, root cause investigation and yield improvement.
• Collaborate with customers, partners and cross-functional teams on advanced packaging projects.
• Support project execution, technical reporting, technology transfer and team mentoring.

Skills

Hybrid bonding

Wafer bonding

DOE methodologies

Education

PhD in Materials Science, Electrical/Mechanical/Chemical Engineering, Physics

Job description

A*STAR-IME in Singapore is seeking a Senior Scientist to lead the development and optimization of hybrid bonding technologies for next-generation semiconductor, photonics, AI, and HPC applications. The role focuses on Cu/SiO₂ hybrid bonding, wafer-level or chip-level bonding processes, reliability assessment, and advanced materials characterization.

You will work with research scientists, industry partners, equipment vendors, and customers to develop innovative solutions for future heterogeneous