Senior Research Fellow [Advanced Process Module]

National University of Singapore; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

National University of Singapore is seeking a Senior Research Fellow in the Electrical and Computer Engineering Department on an Advanced Process Module. The role focuses on leading wafer processing and advanced packaging research, including 2.5D/3D integration and hybrid bonding technologies, in collaboration with industry partners and tool vendors.

The candidate will spearhead programs, drive innovation, and contribute to publications and patents while coordinating a cross-disciplinary team at

Qualifications

• Ph.D. or equivalent in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Materials Science or equivalent.
• 15+ years of industrial R&D or advanced research in wafer foundry process and semiconductor packaging.
• Experience in Silicon photonics integration including CPO and FAU.
• Proficiency in data analysis using statistical tools.
• Excellent communication and collaboration in a research environment.

Responsibilities

• Address key issues of state-of-the-art technologies in wafer processing and advanced packaging to improve capability, integration, reliability and scalability.
• Develop CoW and WoW hybrid bonding technologies and integration approaches for 2.5D/3D and heterogeneous integration.
• Develop innovative process and integration solutions for next-generation heterogeneous integration supporting 2.5D/3D packaging and chiplet integration.
• Contribute to invention disclosures, patent filings, and technology commercialization; publish in high-impact journals and present at conferences.

Skills

Data analysis

Communication

Leadership

Writing and presenting

Education

PhD or equivalent in engineering/science

Job description

Job Title: Senior Research Fellow [Advanced Process Module]

University-Level Unit: College of Design and Engineering

Faculty/Department-Level Unit: Electrical and Computer Engineering

Employee Category: Research Staff

Location_ONB: Kent Ridge Campus

Posting Start Date: 15/10/2026

Job Description

The ECE Department at NUS is seeking a Senior Research Fellow. An experienced and highly motivated researcher to lead and contribute to wafer process module on advanced patterning, involving lithography, dry and wet etching. Knowledge and experiences on the integration of Cu interconnect and hybrid bonding is a plus.

The successful candidate will play a dual role: spearheading the development of on in 2.5D, 3D, chiplet, and heterogeneous integration programs to innovate and validate next generation leadership system scaling technologies.

This position also offers a unique opportunity to work closely with leading process tool vendors, academic researchers and industrial partners, to conduct cutting-edge research in key process module and integration, to resolve the bottleneck issues of the state-of-the-art packaging technologies.

Responsibilities Will Involve

• Addressing key issues of the SOTA technologies. Technology challenges associated with wafer processing and advanced packaging, with the aim of improving process capability, integration performance, reliability, and scalability.
• CoW and WoW Hybrid Bonding Technology Development Conduct research and development in CoW and WoW hybrid bonding technologies. And key process modules and integration approaches required to enable advanced 2.5D/3D and heterogeneous integration.
• Next Generations Heterogeneous Integration Technology Development Develop innovative process and integration solutions for next-generation heterogeneous integration. Supporting advanced 2.5D/3D packaging, chiplet integration, and emerging system integration technologies.
• Innovation & Intellectual Property Contribute to invention disclosures, patent filings, and technology commercialization activities. Publish research outcomes in high-impact journals and present at leading semiconductor and packaging conferences.
• Leadership Lead a critical module team to enable leadership system integration technology for 2.5D and 3D/hybrid bonding systems. Expanded Project Management: Acting as the primary technical interface and taking full ownership of deliverables.

Job Requirements

• Reporting to PI Prof Yu Chen-Hua.
• Ph.D. or equivalent degree in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Material Science or its equivalent from a reputable University/Institute is preferred.
• 15+ years of industrial R&D, or advanced research and development experience in wafer foundry process and semiconductor packaging.
• Candidate with profound experience in Silicon photonics integration including CPO and FAU.
• And proven outstanding industry achievements in both wafer technology and advanced 2.5D/3D packaging technologies will have advantage.
• Proficiency in data analysis and interpretation using statistical tools and software packages.
• Excellent communication skills and the ability to work effectively in a collaborative research environment.
• Motivated and possesses effective communication skills including writing and presenting.
• Ability to present complex technical concepts to multidisciplinary audiences.
• Open to Fixed Term Contract.

Req ID: 34675