Senior Reliability Engineer: AI Hardware & Packaging

AMD Ventures; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

AMD is seeking a proactive senior reliability engineer in Singapore to lead qualification strategies for AI, datacenter, and HPC products. You will own reliability programs across device, package, board, and system levels, driving data-driven decisions and cross-functional collaboration with design, manufacturing, and quality teams.

You will develop advanced testing methodologies, perform failure analysis, and guide NPI readiness while navigating complex photonics, silicon packaging, and

Qualifications

• Experience in reliability/qualification in semiconductor packaging and high-speed interconnects.
• Knowledge of reliability qualification methodologies, accelerated testing, failure analysis.
• Familiarity with JEDEC, GR-468, IPC standards and NPI qualification processes.

Responsibilities

• Own and drive reliability strategies for AI/datacenter products including silicon photonics and advanced packaging.
• Define and execute qualification and reliability test plans for industry-leading products.
• Develop, optimize, and automate board, system, package, and optical reliability methodologies.
• Solve complex reliability challenges through data-driven insights and root-cause investigations.
• Analyze reliability data and translate insights into actionable product improvements.
• Influence engineering decisions through reliability expertise and cross-functional collaboration.
• Drive continuous innovation in reliability to enable next-generation AI, networking, and optical connectivity.

Skills

Reliability engineering

Semiconductor

Photonic technologies

High-speed interconnects

Datacenter technologies

Analytical skills

Education

Bachelor’s degree in Electrical/Electronics Engineering or related field

Optics & Photonics

Tools

Optical test equipment

Packaging analysis tools

Job description

AMD is seeking a proactive senior reliability engineer in Singapore to lead qualification strategies for AI, datacenter, and HPC products. You will own reliability programs across device, package, board, and system levels, driving data-driven decisions and cross-functional collaboration with design, manufacturing, and quality teams.

You will develop advanced testing methodologies, perform failure analysis, and guide NPI readiness while navigating complex photonics, silicon packaging, and