Senior R&D Electrical PCA Lead Engineer

HP

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+
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Job summary

HP is seeking an experienced R&D Electrical Hardware Engineer to lead PCA design and system-level electrical quality for NPI programs. The role combines hands-on engineering with strong technical leadership and cross-functional collaboration across mechanical, firmware, operations, and supplier teams.

The successful candidate will drive design reviews, risk assessments and key engineering decisions, while ensuring EMI/EMC, SI/PI, and thermal considerations are integrated.

Qualifications

  • Bachelor’s or Master’s degree in Electrical/Electronic Engineering or related field.
  • Demonstrated track record of delivering at least 2 NPI products from concept to production.
  • Strong clear, concise communication on both written and verbal, and stakeholder management skills.

Responsibilities

  • Serve as the primary EE technical lead for PCA design and system-level integration in support of NPI program.
  • Lead design reviews, technical risk assessments, and key engineering decisions throughout the lifecycle.
  • Define and enforce EE best practices, design guidelines, and quality standards.
  • Ensure SI/PI, EMC/EMI, and thermal considerations are properly addressed in designs.
  • Own system-level quality and reliability, including DfX, failure analysis, and corrective actions.
  • Identify trends and opportunities for optimizing product output, quality enhancements and cost of delivery.
  • Collaborate with cross-functional teams (ME, FW, Operations, suppliers) for seamless integration

Skills

PCA design
technical leadership
stakeholder management

Education

Bachelor’s or Master’s degree in Electrical/Electronic Engineering

Job description

HP is seeking an experienced R&D Electrical Hardware Engineer to lead PCA design and system-level electrical quality for NPI programs. The role combines hands-on engineering with strong technical leadership and cross-functional collaboration across mechanical, firmware, operations, and supplier teams.

The successful candidate will drive design reviews, risk assessments and key engineering decisions, while ensuring EMI/EMC, SI/PI, and thermal considerations are integrated.

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