Senior Process Module Engineer, Advanced Packaging (2.5D/3D)

GLOBALFOUNDRIES SINGAPORE PTE. LTD. - FAB 2; Singapore; On-site; SGD 120,000 - 190,000; Full time

Job summary

GlobalFoundries Singapore is seeking an Experienced Member of Technical Staff (MTS) or Principal Process Engineer to lead the setup and optimization of advanced packaging processes. The role covers bond and debond, pre-bond, plasma/UV/cleaning steps, die re-constitution, annealing, and TSV tasks across multi-stack bond wafer / Die-to-Wafer programs.

Responsibilities include startup and qualification of new processes, collaboration with Equipment Engineers, and driving process robustness with

Qualifications

• Bachelor's, Master's, or PhD in engineering discipline as required.
• 8+ years in advanced packaging industry for higher degree
• Hands-on experience with advanced packaging (Si interposer, D2W, W2W) processes.

Responsibilities

• Design, execute, and analyze experiments to develop advanced packaging etch processes.
• Startup and qualify new processes and equipment within timeline.
• Collaborate with Equipment Engineer on equipment acceptance and tool matching.
• Understand repeatability and reproducibility (R&R).
• Improve process robustness for high-volume manufacturing using DOE and data-driven decisions.
• Apply lean and Six Sigma methodologies to manufacturing processes.
• Support Integration and Quality to meet qualifications and reliability requirements.
• Sustain and improve process SPC to meet quality, cost, and productivity goals.
• Coach and develop engineers on advanced packaging etch knowledge.

Skills

Verbal communication

Written communication

Interpersonal skills

Cross-cultural collaboration

Problem solving

Education

BS in Electrical/Materials/Chemical Eng

MS or PhD in a related field

Tools

D2W tooling

Bond & Debond equipment

Job description

GlobalFoundries Singapore is seeking an Experienced Member of Technical Staff (MTS) or Principal Process Engineer to lead the setup and optimization of advanced packaging processes. The role covers bond and debond, pre-bond, plasma/UV/cleaning steps, die re-constitution, annealing, and TSV tasks across multi-stack bond wafer / Die-to-Wafer programs.

Responsibilities include startup and qualification of new processes, collaboration with Equipment Engineers, and driving process robustness with