Lead Electroplating Process Engineering Manager

Applied Materials, Inc.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Applied Materials, Inc. in Singapore seeks a Manager of Process Engineering (Electroplating) to lead the development and optimization of next-generation electroplating processes for advanced semiconductor packaging.

You will manage a team of engineers, drive process innovation, support customer engagements, and collaborate across global teams. The role requires 8+ years in semiconductor process engineering, strong copper plating knowledge, and a proven track record in leading R&D process

Qualifications

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
• 8+ years semiconductor process engineering experience, including hands-on electroplating/electrochemical deposition technologies.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.

Responsibilities

• Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies.
• Manage, develop, plan and execute process engineering projects for entire range of products.
• Interact with key customers to resolve significantly complex process engineering issues for entire range of products.
• Develop and implement new technology, products and analytical instrumentation.
• Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products.
• Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products.
• Contributes to market share gains through technology improvement.

Skills

Electroplating

Wafer-level packaging

DOE/Statistical analysis

Leadership

Process development

Equipment troubleshooting

Education

Bachelor’s/Master’s/PhD in Chemical Eng. or related

Tools

DOE Software

Analytical instrumentation

Job description

Applied Materials, Inc. in Singapore seeks a Manager of Process Engineering (Electroplating) to lead the development and optimization of next-generation electroplating processes for advanced semiconductor packaging.

You will manage a team of engineers, drive process innovation, support customer engagements, and collaborate across global teams. The role requires 8+ years in semiconductor process engineering, strong copper plating knowledge, and a proven track record in leading R&D process