Principal / Senior/ Engineer, Package Characterization - APTD

Micron Technology

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+

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Job summary

Micron Technology, Inc. in Singapore is seeking an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD) to provide package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures.

You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to

Qualifications

  • PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline.

Responsibilities

  • Conduct Electrical Characterization
  • Understand PFA techniques available for de-processing failures
  • Understand assembly and test process
  • Perform electrical verification to confirm failures
  • Establish best known method for de-processing package
  • Provide Data Analysis
  • Understand backend test flows, qualification methodologies and be able to pull relevant information
  • Communicate with Internal/External Groups
  • Document failure analysis techniques used to isolate failure for other groups
  • Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
  • Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs
  • Provide Technical Expertise
  • Conduct TMO training and FA certification
  • Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.
  • Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.
  • Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.
  • Maintain Equipment Coordinate calibrations (external to Micron)
  • Procure parts as needed
  • Coordinate host vendors to support equipment repair
  • Manage Laboratory
  • Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.
  • Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.
  • To manage the exhaust and scrubber systems of the FA Lab.
  • To maintain records and procedures as per Micron GOPs

Skills

Electrical characterization
Data analysis
Cross-functional collaboration
Technical mentorship

Education

PhD
Master’s degree
Bachelor’s degree in Materials Science / Chemical Engineering / Electrical/Electronics Engineering

Tools

SEM
EDX
FIB
TEM
AFM
FTIR
XPS
X-ray
CSAM
Ion Milling
delayering
decapsulation techniques

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Job Description As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Responsibilities and Tasks
  • Conduct Electrical Characterization
  • Understand PFA techniques available for de-processing failures
  • Understand assembly and test process
  • Perform electrical verification to confirm failures
  • Establish best known method for de-processing package
  • Provide Data Analysis
  • Understand backend test flows, qualification methodologies and be able to pull relevant information
  • Communicate with Internal/External Groups
  • Document failure analysis techniques used to isolate failure for other groups
  • Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
  • Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs
  • Provide Technical Expertise
  • Conduct TMO training and FA certification
  • Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.
  • Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.
  • Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.
  • Maintain Equipment Coordinate calibrations (external to Micron)
  • Procure parts as needed
  • Coordinate host vendors to support equipment repair
  • Manage Laboratory
  • Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.
  • Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.
  • To manage the exhaust and scrubber systems of the FA Lab.
  • To maintain records and procedures as per Micron GOPs
Education and Experience

PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline.

4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.

Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.

Strong communication skills with the ability to collaborate effectively across internal teams and external partners.

A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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