Senior NPI Packaging Engineer (Semiconductor)

Micron Technology, Inc; Singapore; On-site; SGD 100,000 - 130,000; Full time

Job summary

Micron Technology, Inc in Singapore seeks an experienced Product Owner to lead new product introduction efforts. This role involves collaborating with cross-functional teams to meet business objectives and manage product lifecycle from NPI to end-of-life.

The ideal candidate will have at least 8 years of experience in the semiconductor industry, with strong packaging knowledge and a background in engineering. Micron offers an inclusive workplace and provides opportunities for qualified applicants.

Qualifications

• Master's or Bachelor's degree in relevant engineering discipline.
• 8+ years in MNC semiconductor for mobile and automotive.
• Strong knowledge in backend engineering and packaging.

Responsibilities

• Lead and manage new product introduction activities.
• Drive NPI process through phase-gate reviews.
• Monitor product yield trends and reliability.

Skills

Packaging knowledge

Data analysis

Technical knowledge in module manufacturing

Knowledge of AI-assisted tools

Education

Master’s or Bachelor’s degree in Mechanical, Material, Chemical or related Engineering

Tools

JMP analysis

Job description

Micron Technology, Inc in Singapore seeks an experienced Product Owner to lead new product introduction efforts. This role involves collaborating with cross-functional teams to meet business objectives and manage product lifecycle from NPI to end-of-life.

The ideal candidate will have at least 8 years of experience in the semiconductor industry, with strong packaging knowledge and a background in engineering. Micron offers an inclusive workplace and provides opportunities for qualified applicants.