Senior NAND Cell Device Engineer – 3D NAND Innovation

Micron Memory Malaysia Sdn Bhd

Singapore

On-site

SGD 140,000 - 190,000

Full time

14 days+
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Job summary

Micron Technology, Inc. in Singapore is seeking a Senior/Principal Engineer to perform electrical characterization of 3D NAND memory cells and develop novel device solutions for next-generation non-volatile memory technologies.

You will work with process, integration, product, and design teams to identify improvement opportunities, refine specifications, and address circuitry and array challenges in a collaborative R&D environment.

Qualifications

  • MS/PhD in Electrical Engineering, Physics, Materials Science or a related field.
  • Strong foundation in semiconductor device physics and fabrication processes.
  • Experience with data analysis and scripting tools such as Python, JMP/JSL, or Perl.

Responsibilities

  • Characterize NAND memory cell and array behavior to identify device improvement opportunities.
  • Develop understanding of performance and reliability requirements for new NAND cells and help refine specifications.
  • Analyze automated tester data to identify qualification gaps, new device corners, and screening improvements.
  • Contribute to NAND cell architecture and process definition through device physics and array operation expertise.
  • Collaborate with process, integration, product, and design teams to address cell challenges and deliver improvement roadmaps.

Skills

Device physics
Semiconductor fabrication
Data analysis
Python
JMP/JSL
Perl
Communication

Education

MS/PhD in Electrical Engineering, Physics, or Materials Science

Tools

Python
JMP/JSL
Perl

Job description

Micron Technology, Inc. in Singapore is seeking a Senior/Principal Engineer to perform electrical characterization of 3D NAND memory cells and develop novel device solutions for next-generation non-volatile memory technologies.

You will work with process, integration, product, and design teams to identify improvement opportunities, refine specifications, and address circuitry and array challenges in a collaborative R&D environment.

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