Senior Mechanical Design Engineer [ Semiconductor Equipment | TCB | Flip-chip ]

The Supreme HR Advisory Pte Ltd; Singapore; On-site; SGD 67,000 - 100,000; Full time

Job summary

The Supreme HR Advisory Pte Ltd is seeking a Mechanical Design Engineer / Senior Mechanical Design Engineer in Singapore. You will design mechanical systems for advanced semiconductor packaging equipment, develop 3D models, drawings, BOMs and tech docs, and work closely with multi-disciplinary teams.

The role requires 2+ years of design experience, proficiency with Creo or similar CAD tools, and a Diploma or Bachelor in Mechanical Engineering.

Qualifications

• Diploma or bachelor’s degree in Mechanical Engineering or related discipline.
• Approximately 2+ years of mechanical design experience in semiconductor equipment or precision automation.
• Proficiency in 3D CAD software (Creo, SolidWorks, Inventor, CATIA, NX).
• Able to prepare detailed manufacturing and assembly drawings.

Responsibilities

• Design mechanical systems and modules for semiconductor packaging equipment.
• Develop 3D models, drawings, BOMs and documentation.
• Select mechanical and motion components (bearings, linear guides, motors, encoders).
• Support assembly, alignment, testing and customer qualification.

Skills

Mechanical design

Tolerance analysis

Thermal management

Precision engineering

Education

Diploma/Bachelor in Mechanical Engineering

Tools

Creo

SolidWorks

Inventor

CATIA

NX

Job description

Position title : Mechanical Design Engineer / Senior Mechanical Design Engineer

• Admirax St

• 5 Day A Week (9:00am - 6:00pm)

• SGD 6,000 – SGD 9,000/month (Based on experience and technical capability)

Responsibilities:

• Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.

• Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.

• Design equipment modules such as:

  • Wafer handling systems

  • Substrate, strip, panel, or glass-panel handling systems

  • Die ejection, die pickup, and die transfer mechanisms

  • Precision XY, XYZ, XYZT, and multi-axis positioning stages

  • Bondheads and thermal bondheads

  • Micro-Z, force-control, compliance, and tip-tilt mechanisms

  • Heating, cooling, vacuum, gas, and thermal isolation structures

  • Conversion kits, change parts, fixtures, tooling, nests, and bond tools

• Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.

• Conduct tolerance stack-up and design reviews for critical precision assemblies.

• Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.

• Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.

• Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.

• Investigate machine problems and implement practical design improvements.

• Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.

• Maintain proper engineering documentation and design-change records.

Requirements:

Candidates will be considered from the following backgrounds, in order of preference:

1. TCB equipment

   • Thermo-Compression Bonding

   • Chip-to-substrate, chip-to-wafer, or chip-to-panel bonding

   • HBM, large-die, fluxless bonding, or advanced packaging equipment

2. Flip-chip or die-bonding equipment

   • Flip-chip bonders

   • Die bonders

   • Die attach or semiconductor pick-and-place systems

3. Semiconductor handling equipment

   • Wafer handling

   • Substrate, strip, panel, or glass-panel handling

   • Die ejection, die pickup, or die transfer

   • EFEM, robot, aligner, elevator, buffer, or transfer mechanisms

4. Precision positioning stages

   • XY, XYZ, XYZT, or multi-axis stages

   • Gantry systems

   • Cross-roller-bearing stages

   • Flexure-guided mechanisms

   • High-accuracy motion platforms

5. Bondhead or thermal module design

   • Bondheads

   • Thermal bondheads

   • Force-control mechanisms

   • Micro-Z systems

   • Load-cell integration

   • Heating and cooling assemblies

   • Parallelism or tip-tilt correction systems

6. Conversion kits, tooling, and fixtures

   • Machine conversion kits

   • Product change parts

   • Vacuum tooling

   • Bond tools

   • Wafer, substrate, or panel fixtures

   • Calibration and alignment jigs

Candidates are not expected to have experience in all the above areas. Strong design capability in one or more relevant modules is sufficient.

Requirements:

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.

• Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.

• Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.

• Able to prepare detailed manufacturing and assembly drawings.

• Good understanding of:

  • Fits and tolerances

  • GD&T

  • Bearings and linear-motion components

  • Machining and fabrication processes

  • Material selection and surface treatment

  • Mechanical assembly and alignment

• Able to develop practical mechanism concepts rather than only produce drawings from instructions.

• Willing to support machine assembly, debugging, testing, and continuous improvement.

• Experience in semiconductor packaging or semiconductor automation equipment.

• Experience designing precision, high-stiffness, or thermally stable machine modules.

• Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.

• Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.

• Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.

• Experience taking a module from concept through assembly, testing, and customer acceptance.

• Familiarity with DFM, DFA, cost reduction, and engineering change control.

• Experience with prototype, customised, or first-of-a-kind equipment development.