Senior HV Process Engineer - Semiconductor DOE & Transfer

AlwaysHired Pte. Ltd.; Singapore; On-site; SGD 79,000 - 95,000; Full time

Job summary

AlwaysHired Pte. Ltd. is seeking a hands-on engineer to advance semiconductor device and process development. The role focuses on developing, transferring, and qualifying production-ready processes for reliable yield and seamless line transfer.

The candidate will run DOE studies to optimize integration, handle prototype lots, and resolve process issues across HV, BCD, RF, NV, and BiCOMS technologies.

Qualifications

• Master’s degree or above in semiconductor/electronics/electrical/Physics/Materials engineering; Ph.D. preferred.
• Minimum 3 years of experience in a semiconductor manufacturing environment with device/process development or integration.
• Experience in HV, BCD, RF, NV, and BiCOMS device/technology development is desirable.

Responsibilities

• To develop, transfer & qualify new & derivative processes and seamless transfer to Production.
• Run design of experiments (DOE) to optimize process integration and to determine the process specification
• Handle and ensure new prototype lot success.
• Resolve all process integration issues by ensuring all window checks are done on critical process steps identified in failure mode effect and analysis (FMEA)
• Work on inline & electrical test (ET) low CPK parameters & test vehicle esort yield improvement
• Identify and correct all ET related problems that may affect seamless production
• Ensure all runsheets are "production worthy"

Education

Master’s degree or above in semiconductor/electronics/electrical/Physics/Materials engineering

Ph.D. preferred

Job description

AlwaysHired Pte. Ltd. is seeking a hands-on engineer to advance semiconductor device and process development. The role focuses on developing, transferring, and qualifying production-ready processes for reliable yield and seamless line transfer.

The candidate will run DOE studies to optimize integration, handle prototype lots, and resolve process issues across HV, BCD, RF, NV, and BiCOMS technologies.