Senior Engineering Lead, Power Systems & Drives
Dyson GmbH
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Job summary
Dyson GmbH in Singapore is seeking a Senior Engineering Manager for Power Systems & Drives to lead the development of next-generation power electronics platforms. This role builds and leads a high-performing team focused on motor drive hardware, heater drive hardware, APFC power systems, and advanced power conversion technologies.
You will guide strategic direction, talent development, and execution across product programmes, collaborating with Product Development, Systems, Firmware, Mechanical,
Qualifications
- Bachelor's or Master's degree in Electrical/Electronics/Power Electronics or related discipline.
- 12+ years of experience in power electronics product development.
- Proven leadership of engineering teams delivering complex hardware programmes.
- Strong background in motor drive, heater drive, APFC, and high-power converters.
- Experience with multi-disciplinary teams and product development environments.
- Deep knowledge of power electronics architectures and topologies (PFC, Flyback, LLC, Buck, Boost, Half-Bridge, Full-Bridge).
Responsibilities
- Lead and grow a world-class engineering team.
- Define and execute technology roadmaps for Power Systems & Drives.
- Deliver engineering programmes on time, within budget, meeting quality and reliability targets.
- Drive governance, design reviews, and milestone reviews.
- Collaborate with cross-functional teams including product development, firmware, manufacturing, and quality.
Skills
Education
Job description
Dyson GmbH in Singapore is seeking a Senior Engineering Manager for Power Systems & Drives to lead the development of next-generation power electronics platforms. This role builds and leads a high-performing team focused on motor drive hardware, heater drive hardware, APFC power systems, and advanced power conversion technologies.
You will guide strategic direction, talent development, and execution across product programmes, collaborating with Product Development, Systems, Firmware, Mechanical,
'/%3e%3cpath%20d='M101.744%2012.4726L102.894%2016.1947L99.0021%2013.2201L101.744%2012.4726ZM105.3%208.40937H100.488L99.0026%203.59473L97.5116%208.41047L92.7%208.40385L96.5965%2011.3834L95.1055%2016.1942L99.0021%2013.2196L101.408%2011.3834L105.3%208.40992V8.40937Z'%20fill='white'/%3e%3cdefs%3e%3clinearGradient%20id='paint0_linear_5593_1381'%20x1='90'%20y1='9.44471'%20x2='99'%20y2='9.44471'%20gradientUnits='userSpaceOnUse'%3e%3cstop%20stop-color='%2300AD70'/%3e%3cstop%20offset='0.998594'%20stop-color='%2300B67A'/%3e%3cstop%20offset='1'%20stop-color='%23DCDCE6'/%3e%3c/linearGradient%3e%3c/defs%3e%3c/svg%3e){kind=small}
