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Micron Semiconductor Asia Operations Pte. Ltd. seeks a Senior Engineer to advance thin film (CVD/Diffusion) process development for next-gen NAND.
You will run experiments, characterize films, troubleshoot issues, and help transfer processes to manufacturing in a collaborative, data-driven setting. Strong fundamentals in thin film deposition, film characterization, and DOE/SPC are essential, with experience collaborating across integration, metrology, failure analysis, yield, and equipment
The Senior Engineer supports Thin Films (CVD/Diffusion) process development for advanced NAND technology by executing experiments, characterizing films, troubleshooting process and tool issues, and supporting process transfer into manufacturing. Success in this role requires strong fundamentals in thin film deposition and characterization, disciplined experimental execution (DOE/SPC), and effective collaboration across integration, metrology, failure analysis, yield, and equipment partners.
Develop,optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.
Design and execute experiments, analyze data, and communicate results inappropriate technicalforums.
Perform film characterization usingappropriate techniques(examples referenced: SEM, TEM, XPS, SIMS, AFM) and correlate results to process outcomes.
Support process transfer and pilot line execution, including sustaining process maturity/capability for processes under ownership.
Collaborate with multi-functional partners (Process Integration, Metrology, Surface/Characterization labs, Electrical Failure Analysis, Yield, Manufacturing, and equipment vendors/suppliers) to ensure robust processes that meet physical/electrical requirements.
Maintainaccuratedocumentation of experiments, process settings, and learnings; produce technical reports and summaries.
Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment andcomplying withorganizational standards and legal requirements.
Contributes to a culture of continuous improvement byidentifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
PhD, or Master’s ≥3 yrs, or Bachelor’s ≥5 yrsof relevant experience in
Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field
Demonstrated foundation in thin film deposition and characterization; R&D/PD environment readiness is important for this role.
Fundamentals of thin film deposition (CVD/Diffusion) and film characterization.
DOE/SPC basics; ability to analyze experimental data and draw conclusions.
Understanding ofplasma/vacuum systems and process-chemistry relationships (where applicable).
Structured problem-solving and learning agility in an R&D environment.
Clear communication and cross-functional collaboration.
Exposure to dielectric / carbon-based films and NAND structural/electrical requirements.
Experience working with equipment suppliers or tool qualification/transfer activities.
People–Respect, develop and empower others
Innovation–Drive continuous improvement and breakthrough thinking
Tenacity–Show grit and determination
Collaboration–Build trust and foster teamwork
Customer Focus–Deliver excellence and value