Principal Engineer – Process Development, Cell Film, NAND

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. in Singapore seeks a Principal Engineer to lead cell film process development, define strategic direction, and drive manufacturability at scale for next‑generation NAND devices.

You will lead cross‑functional teams, own end‑to‑end module development, and ensure successful transfer into high‑volume manufacturing. The role requires solving complex technical challenges, mentoring engineers, and collaborating with internal and external partners while

Qualifications

• PhD with ≥5 years (or Master’s ≥7, or Bachelor’s ≥10) in Electrical Engineering, Materials Science, Chemical Engineering, Physics or related field.
• Experience leading thin film R&D for microelectronic devices and managing complex technology development.

Responsibilities

• Define and implement technical strategy for cell film process development aligned to business goals.
• Lead multi-functional development, integration, and scaling of thin film processes for advanced NAND devices; ensure manufacturability and scalability for high-volume manufacturing.
• Drive technology transfer and ramp-up to ensure seamless transition from R&D to manufacturing.
• Resolve complex technical challenges (RCA/mitigation of failures) and lead yield improvement programs through process/material innovations.
• Mentor senior engineers, shape technical direction, and represent the function in external forums and collaborations.

Skills

ALD/CVD processes

Process–device interactions

Materials & chemistry improvements

DOE, SPC & analytics

Technical leadership & mentoring

Education

PhD≥5 yrs or Masters≥7 yrs or Bachelors≥10 yrs in EE/Materials/Chemical Eng/Physics

Job description

Role Summary

The Principal Engineer provides technical leadership for Cell Film process development, defining technical direction, fostering innovation, and ensuring successful integration of new processes into manufacturing to enable next-generation NAND device scaling. Defines and implements technical strategy; leads cross-functional teams; owns end-to-end module development with manufacturability/scalability readiness. Resolves complex technical challenges with business impact and drives transfer and ramp readiness into high-volume manufacturing.

MainResponsibilities

Strategy, Roadmap & Technical Direction

• Define and implement technical strategy for cell film process development aligned to business and technologyobjectives.

• Identifyemerging trends/risks/opportunities and recommend future investments/initiatives.

End-to-End Module Development & Scaling

• Lead multi-functional development, integration, and scaling of thin film processes tailored for advanced NAND devices; ensure manufacturability/scalability/readiness for integration.

• Drive technology transfer and ramp-up activities to ensure seamless transition from R&D to high-volume manufacturing.

Complex Problem Solving & Business Outcomes

• Resolve complex technical challenges (including RCA/mitigation of process/device failures).

• Lead cost reduction, yield improvement, and reliability enhancement programs via innovative process/materialutilization.

Leadership & External Representation

• Mentor senior engineers and influence technical direction across theorganization;represent the function in technical forums and strategic collaborations (consortia, conferences, joint development).

Other Responsibilities

• Mentor senior engineers and influence technical direction across the organization.

• Represent the function in technical forums and strategiccollaborations;benchmark against industry standards.

• Identifyemerging trends/risks/opportunities and recommend future investments/critical initiatives.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Qualifications / Experience

• PhD≥5yrs, or Master’s ≥7yrs, or Bachelor’s ≥10yrsof relevant experience in
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,

• With experience in thin film R&D for microelectronic devise, with a proventrack recordof leading complextechnologydevelopment

Must-Have Technical Skills

• Deep hands-onexpertiseinALD/CVD thin film processesfor 3D NAND cell applications, including process development, optimization, and sustainment in manufacturing.

• Strong understanding ofprocess–device interactions, scaling challenges, and reliability behavior, with the ability to diagnose film-related performance and yield issues.

• Proven ability to drivematerials, chemistry, and process improvements(including tool-related optimizations) through structured experimentation and cross-functional collaboration.

• Proficient inDOE, SPC, and data analyticstooptimizeprocesses and resolve complex issues, while serving as atechnical lead/mentoracross process, integration, and manufacturing teams.

Must-Have Soft Skills

• Structured problem-solving and learning agility in an R&D environment.

• Clear communication and cross-functional collaboration.

Highly Preferred

• Contributes to technology benchmarking, roadmap inputs, and clear technical documentation or IP generation.

Embody Micron’s core values:

• People–Respect, develop and empower others

• Innovation–Drive continuous improvement and breakthrough thinking

• Tenacity–Show grit and determination

• Collaboration–Build trust and foster teamwork

• Customer Focus–Deliver excellence and value