Senior Engineer

DenseLight Semiconductors Pte Ltd; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

DenseLight Semiconductors Pte Ltd is seeking an experienced engineer to drive assembly and packaging process improvements. You will document processes, implement controls for repeatable quality, and lead cross-functional projects focused on yield, capacity, and reliability.

The role emphasizes strong analytical thinking and mentorship within the team. The candidate should bring practical experience in semiconductor assembly and packaging, with a track record of innovation and collaboration

Qualifications

• Strong analytical skills to identify and resolve process issues.
• Ability to develop long-term strategies for process improvement and innovation.
• Lead projects and collaborate with cross-functional teams.
• Mentor junior engineers and lead teams in process improvement initiatives.

Responsibilities

• Improve assembly and packaging processes for yield, quality and productivity.
• Document and implement process controls to ensure repeatability and traceability.
• Evaluate and optimize steps for yield and capacity improvements.
• Lead preventive/corrective actions and best-known methods for troubleshooting.

Skills

DOE (design of experiment)

Analytical skills

Project leadership

Mentoring juniors

Education

Degree in Mechanical Engineering / Materials Science

Job description

Job responsibilities

• Assembly and packaging process improvement and optimization in systematic manner
• Documentation for key assembly and packaging processes, and implementation of effective process control practices to achieve repeatability of quality assembly process
• Propose, evaluate and refine current process steps for yield and capacity improvements
• Documentation and implementation of preventive and corrective action, and best-known methods to allow more efficient process troubleshooting
• Qualification of new assembly and packaging related direct materials
• Buyoff and release of new assembly and packaging equipment
• Analyze process out of control and failures, and develop corrective actions accordingly
• Monitor process performance and suggest improvements
• Work with specialists/vendors to design and develop new process
• Ensure compliance with ISO standards and support audit functions
• Provide support for customer returns
• Perform process qualification before handing off to production
• Develop cost-reduction initiatives while still maintaining quality and productivity
• Aligning and supporting packaging roadmaps, developing and optimizing processes to improve product quality and reliability
• Working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems

Requirements

• Degree in Mechanical Engineering / Material Science
• Minimum 5 years’ working experience in semiconductor assembly and packaging process
• Ideally with strong semiconductor assembly and packaging process experience and knowledge, deep understanding about processes such as wafer cleaving, die attachment (especially eutectic die attach), wire bonding, etc.
• Strong skills in developing and refining process to enhance yield, reliability and efficiency, with vast hands‑on experience in DOE (design of experiment) practice
• Strong analytical skills to identify and resolve process issues effectively
• Ability to develop long-term strategies for process improvement and innovation
• Familiarity with industry standards and regulations related to semiconductor assembly and quality control
• Ability to lead projects and work collaboratively with cross‑functional teams
• Able to mentor junior engineers and lead team in process improvement initiatives