Senior Dry Etch Process Engineer: Yield Optimization

Peoplebank Hong Kong Limited

Singapore

On-site

SGD 90,000 - 140,000

Full time

9 hours ago
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Job summary

Our client in Singapore seeks a Senior Process Engineer (Dry Etch) to develop, optimize, and sustain plasma/dry etch processes in a high-volume wafer fab. You will drive process capability, yield improvement, and equipment performance while supporting new technology development and continuous improvement initiatives.

Responsibilities include developing and optimizing etch processes to meet production targets, troubleshooting process and equipment issues, and applying DOE and SPC techniques to

Qualifications

  • Bachelor's degree in engineering/physics/materials science or related field.
  • 3+ years of semiconductor process engineering in Plasma/Dry Etch.
  • Strong knowledge of semiconductor fabrication processes, SPC, DOE, and failure analysis techniques.
  • Hands-on experience with process optimization, troubleshooting, and yield improvement.

Responsibilities

  • Develop, optimize, and sustain Plasma/Dry Etch processes to meet production targets.
  • Troubleshoot process/equipment issues; perform root cause analysis and implement corrective actions.
  • Use SPC, DOE, and data analysis to drive yield, process capability, and optimization.
  • Collaborate with cross-functional teams for technology transfers, process qualifications, and continuous improvement.

Skills

Dry Etch
Plasma Etch
DOE
SPC
Yield Improvement
Root Cause Analysis
Data Analysis

Education

Bachelor's Degree in Engineering/Physics/Materials Science

Job description

Our client in Singapore seeks a Senior Process Engineer (Dry Etch) to develop, optimize, and sustain plasma/dry etch processes in a high-volume wafer fab. You will drive process capability, yield improvement, and equipment performance while supporting new technology development and continuous improvement initiatives.

Responsibilities include developing and optimizing etch processes to meet production targets, troubleshooting process and equipment issues, and applying DOE and SPC techniques to

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