Senior Wet Etch Process Engineer - Yield, SPC & NPI

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 110,000 - 150,000; Full time

Job summary

SILICON BOX PTE. LTD. in Singapore seeks a Member of Technical Staff, Process (Wet) to develop and establish production processes for wet etch and plating. The role focuses on transferring from pilot to production, establishing specs and ensuring quality and safety documentation, with cross-functional leadership in process improvements.

The candidate will lead SPC/DOE initiatives, resolve process issues, and provide training to engineers in a fast-paced wafer/panel production environment.

Qualifications

• Bachelor-level degree required in Materials Science, Microelectronics, Chemical Engineering or similar.
• Hands-on wet etch and plating experience in Wafer-level Fanout packaging or LCD/FPD production lines.
• Experience in process engineering, process control engineering and yield enhancement.
• Experience in leading teams within a process area.
• Familiar with SPC, DOE, FEMA, and 8D reports.

Responsibilities

• Review and accept machine buyoff, set up pilot line process and transfer to production for wet etch.
• Establish, review and update specs, workflow, quality and safety docs for production line.
• Troubleshoot process issues and improve yield and cycle time from NPI to production.
• Lead SPC control towards zero defects; update FMEA and OCAP with cross-functional teams.
• Coordinate with stakeholders on process or quality issues.
• Provide training and guidance to engineers and act as main contact for process matters.

Skills

Wet etch

Plating

Process engineering

Education

Bachelor's degree in Materials Science, Microelectronics, Chemical Engineering or equivalent

Job description

SILICON BOX PTE. LTD. in Singapore seeks a Member of Technical Staff, Process (Wet) to develop and establish production processes for wet etch and plating. The role focuses on transferring from pilot to production, establishing specs and ensuring quality and safety documentation, with cross-functional leadership in process improvements.

The candidate will lead SPC/DOE initiatives, resolve process issues, and provide training to engineers in a fast-paced wafer/panel production environment.