MEMS Dry-Etch Process Engineer: Optimize Yield

HP SINGAPORE (PRIVATE) LIMITED; Singapore; On-site; SGD 60,000 - 120,000; Full time

Job summary

HP SINGAPORE (PRIVATE) LIMITED is seeking a Dry Etch Process Engineer to own and sustain silicon and oxide etch processes in high-volume wafer manufacturing. You will drive optimization, investigate excursions, and lead process characterization and release for new products, working across Process Integration, Manufacturing and Equipment teams.

The role requires 2–5 years of hands-on semiconductor experience in dry etch, strong knowledge of plasma etching fundamentals, and excellent

Qualifications

• 2–5 years hands-on semiconductor wafer fab experience in dry etch process engineering.
• Strong knowledge of plasma etching fundamentals, particularly silicon etch and oxide etch, and profile control.
• Experience with process development, process characterization, DOE, SPC, and statistical data analysis.
• Experience supporting high-volume manufacturing with yield improvement and defect reduction.
• Familiarity with semiconductor process integration and interactions between dry etch and upstream/downstream process modules.
• Experience with process troubleshooting using 8D, DMAIC, or root cause analysis techniques.
• Knowledge of process control systems, FDC, APC, SPC, and process monitoring methodologies is advantageous.
• Strong analytical and problem-solving skills; good communication and documentation skills.

Responsibilities

• Own and sustain dry etch processes for silicon and oxide etching modules.
• Drive process optimization, defect reduction, yield improvement, and process robustness through data analysis, DOE, and continuous improvement projects.
• Investigate process excursions, yield loss, and defectivity issues using structured problem-solving methods; implement corrective actions.
• Develop and maintain process control plans, SPC monitoring, OCAPs, specifications, and process documentation.
• Collaborate with equipment engineers to resolve process-related equipment issues and establish monitoring strategies.
• Lead process characterization, qualification, and release activities for new products and changes.
• Support process transfer, technology development, and integration across teams.
• Analyze process performance data and drive improvements in yield, defectivity, and throughput.
• Work with cross-functional teams to achieve business objectives.
• Provide technical guidance and training to technicians and manufacturing personnel.
• Support quality audits to ensure documentation and processes comply with requirements.

Skills

DOE & SPC

Data analysis

Process optimization

Yield improvement

Defect reduction

8D/DMAIC/RCA

Semiconductor process integration

Dry etch knowledge

Troubleshooting

Documentation skills

Cross-functional collaboration

Communication skills

Education

Bachelor's or Master's Degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or related disciplines

Tools

FDC systems

APC systems

Statistical analysis tools (Minitab/JMP)

Job description

HP SINGAPORE (PRIVATE) LIMITED is seeking a Dry Etch Process Engineer to own and sustain silicon and oxide etch processes in high-volume wafer manufacturing. You will drive optimization, investigate excursions, and lead process characterization and release for new products, working across Process Integration, Manufacturing and Equipment teams.

The role requires 2–5 years of hands-on semiconductor experience in dry etch, strong knowledge of plasma etching fundamentals, and excellent