Senior Associate Engineer (Failure Analysis)

globalfoundries singapore pte. ltd.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

GlobalFoundries Singapore Pte. Ltd. invites a Senior Associate Engineer to perform TEM analysis and FIB‑based sample preparation for semiconductor failure analysis and process characterization.

You will prepare high‑quality TEM samples, image materials, troubleshoot issues, and support urgent fab requests while maintaining safety and quality standards. The role requires night‑shift work, strong problem‑solving, and hands‑on TEM/FIB experience.

Qualifications

• Diploma in Engineering required.
• Willingness to work night shifts.
• Hands-on FIB/TEM experience preferred.
• Basic semiconductor knowledge desired.
• Good interpersonal and communication skills.

Responsibilities

• Perform TEM analysis and TEM sample preparation using FIB for failure analysis and characterization.
• Prepare pre-FIB samples (wafer cleaving, optical inspection, defect navigation).
• Coat samples and perform delayering using RIE/polishing.
• Operate FIB systems for milling, thinning, and lamella preparation for TEM analysis.
• Conduct TEM imaging and EDX analysis; ensure sample quality and cleanliness.
• Support urgent fab requests and communicate across shifts for smooth handover.

Skills

night shift

problem solving

TEM analysis

FIB microscopy

TEM sample preparation

wafer cleaving

optical microscope inspection

sample coating

delayering

RIE polishing

EDX analysis

quality control

communication skills

Education

Diploma in Engineering (Electrical / Electronics / Mechatronics and Microelectronics Engineering)

Tools

Focused Ion Beam (FIB)

Transmission Electron Microscopy (TEM)

EDX

RIE

Job description

Job Summary:

As a Senior Associate Engineer in the Failure Analysis Department, you will perform TEM analysis and FIB sample preparation to support semiconductor failure analysis, process characterization, and manufacturing investigations. The role involves preparing high-quality TEM samples, conducting imaging and material analysis, troubleshooting technical issues, and supporting urgent fab requests. The successful candidate will work closely with engineering teams, maintain laboratory safety and quality standards, and operate effectively in a night-shift environment.

Responsibilities:

• A committed and self‑disciplined individual who can work night shift independently.

• Strong problem‑solving skills, with the ability to troubleshoot sample preparation challenges under time pressure.

• Perform Transmission Electron Microscopy (TEM) analysis and TEM sample preparation using Focused ion-beam (FIB) microscopy to support semiconductor failure analysis and characterization activities, able work in the night‑shift operations if required.

• Conduct pre‑FIB sample preparation, including but not limited to:

• Wafer cleaving

• Optical microscope inspection and defect navigation

• Sample coating

• Sample delayering using RIE/polishing

• Operate Focused Ion Beam (FIB) systems to perform precision milling, thinning, and lamella preparation for TEM analysis.

• Conduct TEM profiling and measurement by bright field and scanning mode imaging. EDX analysis on material element.

• Hands‑on experience and knowledge in TEM and FIB is preferred.

• Ensure samples meet quality, cleanliness, and thickness requirements to enable high‑quality TEM imaging.

• Support urgent and critical requests from fabrication and failure analysis teams, demonstrating a strong sense of urgency and ownership.

• Communicate effectively with engineers, peers, and shift counterparts to ensure smooth handover and continuity across shifts.

• Follow laboratory safety procedures, SOPs, and quality standards at all times.

• Actively participate in continuous improvement activities related to TEM sample preparation and night‑shift efficiency.

Requirements:

• Diploma in Engineering (Electrical / Electronics / Mechatronics and Microelectronics Engineering)

• This role requires to work in the 12hr night-shift pattern.

• Fast learning and good hands-on capability

• Hands‑on experience on FIB for TEM sample preparation is preferred.

• Basic knowledge in semiconductor field

• Good interpersonal and communication skills, team workers, independent and self-disciplined.