Technician - F10 Failure Analysis

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks a skilled professional to perform cross-section analysis and SEM inspection, and TEM sample prep using FIB for detailed inspection.

You will identify defects, isolate faults, and collaborate with engineers to drive production efficiency and quality, applying AI-enabled insights where appropriate. The ideal candidate holds a relevant diploma and has experience in real-time defect or failure analysis, with readiness for 12-hour night shifts in a

Qualifications

• Diploma in Electrical/Electronics/Microelectronics/Mechatronics or related field.
• Experience in Real-Time Defect Analysis (RDA) or Failure Analysis is advantageous.
• Willingness to work permanent 12-hour night shifts.

Responsibilities

• Perform cross-section analysis and SEM inspection to monitor process health and quality.
• Handle TEM sample prep using FIB for TEM inspection.
• Identify defects and failure mechanisms via physical failure analysis with various FA tools.
• Complete physical fault isolation to pinpoint issues affecting production efficiency.
• Collaborate with engineering teams to provide feedback and implement solutions.
• Support wafer analysis with functional failures using FA tools to identify root causes.
• Document analytical findings and approaches to support continuous progress.
• Integrate AI-enabled tools into daily work, ensuring safety and standards compliance.
• Contribute to continuous improvement by testing and sharing AI-enabled enhancements.

Education

Diploma in Electrical/Electronics/Microelectronics/Mechatronics Engineering or a related field

Job description

Responsibilities:

• Perform cross-section analysis and Scanning Electron Microscopy (SEM) inspection to monitor process health and ensure production quality.

• Handle Transmission Electron Microscopy (TEM) sample preparation using Focus Ion Beam (FIB) for detailed TEM inspection.

• Identify defects and failure mechanisms through physical failure analysis using a variety of sample de-processing techniques and a wide range of failure analysis equipment.

• Complete physical fault isolation techniques to pinpoint and resolve issues that may impact production efficiency.

• Collaborate with engineering teams to provide timely feedback and implement solutions to maintain efficient production tool performance.

• Support the analysis of wafers with functional failures by applying various Failure Analysis tools and techniques to isolate defects and identify root causes.

• Preserve comprehensive documentation of analytical findings and approaches to aid continual progress initiatives.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness,exercising sound judgment andcomplying withorganizational standards and legal requirements.

• Contributes to a culture of continuous improvement byidentifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Requirements:

• Diploma in Electrical/Electronics/Microelectronics/Mechatronics Engineering or a related field.

• Proven experience in Real-Time Defect Analysis (RDA) or Failure Analysis related areas is advantageous.

• Ability to work permanent 12-hour night shifts to support our around-the-clock operations.

• Comfortable in handling high-concentration chemicals safely and effectively.

• Strong analytical skills with the ability to carefully review details to successfully implement precise analysis techniques.

• Excellent communication and teamwork abilities to thrive in our collaborative environment.

• Ability to apply baseline digital fluency androle‑appropriate AIliteracy to use AI‑enabled tools responsiblyand effectively for research, analysis, content creation, problem‑solving, operational tasks, and achievingbusiness outcomes.