Senior Associate Engineer (Failure Analysis)

globalfoundries singapore pte. ltd.; Singapore; On-site; SGD 50,000 - 90,000; Full time

Job summary

globalfoundries singapore pte. ltd. in Singapore is seeking a Senior Associate Engineer in the Failure Analysis Department to perform TEM analysis and FIB sample preparation to support semiconductor failure analysis and process characterization.

The role requires preparing TEM samples, imaging and material analysis, troubleshooting issues, and supporting urgent fab requests while maintaining safety and quality standards across night shifts.

Qualifications

• Diploma in Engineering (Electrical / Electronics / Mechatronics and Microelectronics Engineering).
• Willingness to work in a 12-hour night-shift pattern.

Responsibilities

• Perform TEM analysis and TEM sample preparation using FIB to support failure analysis and characterization.
• Prepare high-quality TEM samples and conduct imaging and material analysis.
• Troubleshoot technical issues and support urgent fab requests with a sense of urgency and ownership.
• Maintain laboratory safety and quality standards; follow SOPs and procedures.
• Communicate effectively with engineering teams and shift counterparts for smooth handover across shifts.

Skills

FIB/TEM skills

TEM analysis

Night shift adaptability

Education

Diploma in Engineering

Tools

FIB systems

TEM preparation

Job description

Job Summary:

As a Senior Associate Engineer in the Failure Analysis Department, you will perform TEM analysis and FIB sample preparation to support semiconductor failure analysis, process characterization, and manufacturing investigations. The role involves preparing high-quality TEM samples, conducting imaging and material analysis, troubleshooting technical issues, and supporting urgent fab requests. The successful candidate will work closely with engineering teams, maintain laboratory safety and quality standards, and operate effectively in a night-shift environment.

Responsibilities:

• A committed and self‑disciplined individual who can work night shift independently.

• Strong problem‑solving skills, with the ability to troubleshoot sample preparation challenges under time pressure.

• Perform Transmission Electron Microscopy (TEM) analysis and TEM sample preparation using Focused ion-beam (FIB) microscopy to support semiconductor failure analysis and characterization activities, able work in the night‑shift operations if required.

• Conduct pre‑FIB sample preparation, including but not limited to:

• Wafer cleaving

• Optical microscope inspection and defect navigation

• Sample coating

• Sample delayering using RIE/polishing

• Operate Focused Ion Beam (FIB) systems to perform precision milling, thinning, and lamella preparation for TEM analysis.

• Conduct TEM profiling and measurement by bright field and scanning mode imaging. EDX analysis on material element.

• Hands‑on experience and knowledge in TEM and FIB is preferred.

• Ensure samples meet quality, cleanliness, and thickness requirements to enable high‑quality TEM imaging.

• Support urgent and critical requests from fabrication and failure analysis teams, demonstrating a strong sense of urgency and ownership.

• Communicate effectively with engineers, peers, and shift counterparts to ensure smooth handover and continuity across shifts.

• Follow laboratory safety procedures, SOPs, and quality standards at all times.

• Actively participate in continuous improvement activities related to TEM sample preparation and night‑shift efficiency.

Requirements:

• Diploma in Engineering (Electrical / Electronics / Mechatronics and Microelectronics Engineering)

• This role requires to work in the 12hr night-shift pattern.

• Fast learning and good hands-on capability

• Hands-on experience on FIB for TEM sample preparation is preferred.

• Basic knowledge in semiconductor field

• Good interpersonal and communication skills, team workers, independent and self-disciplined.