Principal / Senior/ Engineer, Package Characterization - APTD Singapore, Singapore Posted 5 hours ago

Micron Technology, Inc.; Singapore; Hybrid; SGD 90.000 - 140.000; Vollzeit

Zusammenfassung

Micron Technology, Inc. is seeking an Advanced Packaging Characterization Engineer within APDT to support development test vehicles, qualifications, customer returns, and new product introductions.

You will lead advanced packaging characterization techniques, classify failures, and contribute to root-cause fixes across product engineering and processing groups. Ideal candidates have 4+ years in semiconductor failure analysis, hands-on experience with SEM/EDX/FIB/TEM and related tools, and strong

Qualifikationen

• 4+ years of semiconductor process experience in R&D or failure analysis.
• Strong communication and collaboration across teams.
• Hands-on experience with analytical tools and techniques.

Aufgaben

• Conduct Electrical Characterization of development test vehicles and failures.
• Provide data analysis and documentation of failure analysis methods.
• Collaborate with Process Integration, Process Development, and Product Eng.
• Maintain and calibrate FA equipment; ensure lab safety and compliance.
• Mentor teammates and participate in technical events and knowledge sharing.

Kenntnisse

Semiconductor failure analysis

Electrical characterization

Data analysis

Cross-functional collaboration

Ausbildung

Materials Science / Electrical / Electronics / Chemical Engineering degree

Tools

SEM

EDX

FIB

TEM

AFM

FTIR

XPS

X-ray

CSAM

Ion Milling

Delayering

Decapsulation

Jobbeschreibung

**Job Description**As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.**Responsibilities and Tasks****Conduct Electrical Characterization*** Understand PFA techniques available for de-processing failures* Understand assembly and test process* Perform electrical verification to confirm failures* Establish best known method for de-processing package**Provide Data Analysis*** Understand backend test flows, qualification methodologies and be able to pull relevant information**Communicate with Internal/External Groups*** Document failure analysis techniques used to isolate failure for other groups* Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA* Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs**Provide Technical Expertise*** Conduct TMO training and FA certification* Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.* Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.* Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.**Maintain Equipment*** Coordinate calibrations (external to Micron)* Procure parts as needed* Coordinate host vendors to support equipment repair**Manage Laboratory*** Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.* Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.* To manage the exhaust and scrubber systems of the FA Lab.* To maintain records and procedures as per Micron GOPs**Education and Experience*** PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline.* 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.* Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.* Strong communication skills with the ability to collaborate effectively across internal teams and external partners.* A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.