Mechanical Design Engineer ( Semiconductor Advanced Packaging Industry ) - YZ11

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 67,000 - 100,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. is hiring a Semiconductor Advanced Packaging Mechanical Design Engineer to join the team in Admirax St. The role focuses on designing mechanical systems for advanced packaging equipment and collaborating with cross-functional teams to ensure precise, reliable performance.

Responsibilities include developing 3D models, drawings, BOMs, and documentation, plus supporting assembly, testing, and customer qualification. 2+ years of relevant experience is required.

Qualifications

• 2+ years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.
• Able to prepare detailed manufacturing and assembly drawings.
• Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.
• Good understanding of fits and tolerances, GD&T, bearings and linear-motion components, machining and fabrication processes.
• Experience designing precision, high-stiffness, or thermally stable machine modules.

Responsibilities

• Design mechanical systems and modules for semiconductor packaging equipment.
• Develop mechanical concepts, 3D models, detailed drawings, BOMs, and technical documentation.
• Plan tolerance stack-up and design reviews for critical precision assemblies.
• Coordinate with process, electrical, software, vision, motion-control, manufacturing, procurement and service teams.
• Support machine assembly, alignment, integration, testing, troubleshooting and customer qualification.
• Investigate machine problems and implement practical design improvements.

Job description

Position title : Semiconductor Advanced Packaging Mechanical Design Engineer

Location: Admirax St

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 6,000 - SGD 9,000/month (Based on experience and technical capability)

Responsibilities:

Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.

Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.

• Wafer handling systems
• Substrate, strip, panel, or glass-panel handling systems
• Die ejection, die pickup, and die transfer mechanisms
• Precision XY, XYZ, XYZT, and multi-axis positioning stages
• Bondheads and thermal bondheads
• Micro-Z, force-control, compliance, and tip-tilt mechanisms
• Heating, cooling, vacuum, gas, and thermal isolation structures
• Conversion kits, change parts, fixtures, tooling, nests, and bond tools

Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.

Conduct tolerance stack-up and design reviews for critical precision assemblies.

Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.

Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.

Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.

Investigate machine problems and implement practical design improvements.

Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.

Maintain proper engineering documentation and design-change records.

Requirements:

Diploma or bachelor's degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.

Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.

Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.

Able to prepare detailed manufacturing and assembly drawings.

Good understanding of:

• Fits and tolerances
• GD&T
• Bearings and linear-motion components
• Machining and fabrication processes
• Material selection and surface treatment
• Mechanical assembly and alignment

Able to develop practical mechanism concepts rather than only produce drawings from instructions.

Willing to support machine assembly, debugging, testing, and continuous improvement.

Experience in semiconductor packaging or semiconductor automation equipment.

Experience designing precision, high-stiffness, or thermally stable machine modules.

Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.

Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.

Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.

Experience taking a module from concept through assembly, testing, and customer acceptance.

Familiarity with DFM, DFA, cost reduction, and engineering change control.

Experience with prototype, customised, or first-of-a-kind equipment development.