Research Fellow, Flexible Electronics & Soft Interconnects

ntu; Singapore; Hybrid; SGD 60,000 - 90,000; Full time

Job summary

NTU is seeking a highly motivated Research Fellow to advance soft, stretchable interconnect technologies for next-generation stretchable and flexible electronic devices. The role covers design, fabrication, and reliability of interconnects on soft substrates, focusing on printable conductive materials, low-temperature and photonic sintering/bonding, and interfacial diffusion processes.

You will contribute to NTU's materials research by bridging interfacial engineering and printed electronics.

Qualifications

• Experience in flexible/stretchable electronics interconnection, printed electronics, conductive inks, soldering, interfacial joining, or low-temperature bonding.

Responsibilities

• Design, fabricate, and characterize stretchable and flexible interconnects and bonded joints on soft, deformable substrates using printable conductive materials and low-temperature/photonic bonding and sintering methods.
• Develop conductive inks, nanoparticle and composite material systems, and interlayer/interface designs for reliable soft interconnection and device integration.
• Conduct microstructural, chemical, mechanical, and electromechanical characterization, including electrical and reliability evaluation under bending, stretching, and cyclic deformation.
• Collaborate with interdisciplinary researchers to integrate soft-interconnect solutions into stretchable electronic devices, sensors, and system-level platforms.
• Assist in manuscript preparation, conference presentations, grant development.

Job description

NTU is seeking a highly motivated Research Fellow to advance soft, stretchable interconnect technologies for next-generation stretchable and flexible electronic devices. The role covers design, fabrication, and reliability of interconnects on soft substrates, focusing on printable conductive materials, low-temperature and photonic sintering/bonding, and interfacial diffusion processes.

You will contribute to NTU's materials research by bridging interfacial engineering and printed electronics.