Research Fellow – Flexible Electronics Interconnects

Nanyang Technological University; Singapore; Hybrid; SGD 60,000 - 90,000; Full time

Job summary

NTU's School of Materials Science and Engineering is seeking a Research Fellow to develop soft, stretchable interconnect technologies for next‑generation flexible electronics. You will design, fabricate, and evaluate conductive interconnects on soft substrates using printable inks and low-temperature bonding and sintering methods.

The role involves material design, microstructure and interfacial analysis, and collaboration across disciplines.

Qualifications

• PhD in Materials Science, Electronic/Electrical Engineering, Mechanical Engineering, Microelectronics, Chemistry, or related field.
• Experience in flexible/stretchable electronics interconnection, printed electronics, conductive inks, soldering, interfacial joining, or low-temperature bonding of advanced materials.
• Familiarity with microstructural, chemical, mechanical, and electrical/electromechanical characterization methods for materials and interfaces.

Responsibilities

• Design, fabricate, and characterize stretchable and flexible interconnects and bonded joints on soft, deformable substrates using printable conductive materials and low-temperature/photonic bonding and sintering methods.
• Develop conductive inks, nanoparticle and composite material systems, and interlayer/interface designs for reliable soft interconnection and device integration.
• Conduct microstructural, chemical, mechanical, and electromechanical characterization, including electrical and reliability evaluation under bending, stretching, and cyclic deformation.
• Collaborate with interdisciplinary researchers to integrate soft-interconnect solutions into stretchable electronic devices, sensors, and system-level platforms where relevant.
• Assist in manuscript preparation, conference presentations, grant development, and reporting to funding agencies and collaborators.

Skills

Flexible electronics

Interconnect engineering

Printed electronics

Low-temperature bonding

Soldering

Interfacial joining

Material characterization

Electrical testing

Education

PhD in Materials Science

Job description

NTU's School of Materials Science and Engineering is seeking a Research Fellow to develop soft, stretchable interconnect technologies for next‑generation flexible electronics. You will design, fabricate, and evaluate conductive interconnects on soft substrates using printable inks and low-temperature bonding and sintering methods.

The role involves material design, microstructure and interfacial analysis, and collaboration across disciplines.