Research Fellow (Flexible Electronics)

ntu; Singapore; Hybrid; SGD 60,000 - 90,000; Full time

Job summary

NTU is seeking a highly motivated Research Fellow to advance soft, stretchable interconnect technologies for next-generation stretchable and flexible electronic devices. The role covers design, fabrication, and reliability of interconnects on soft substrates, focusing on printable conductive materials, low-temperature and photonic sintering/bonding, and interfacial diffusion processes.

You will contribute to NTU's materials research by bridging interfacial engineering and printed electronics.

Qualifications

• Experience in flexible/stretchable electronics interconnection, printed electronics, conductive inks, soldering, interfacial joining, or low-temperature bonding.

Responsibilities

• Design, fabricate, and characterize stretchable and flexible interconnects and bonded joints on soft, deformable substrates using printable conductive materials and low-temperature/photonic bonding and sintering methods.
• Develop conductive inks, nanoparticle and composite material systems, and interlayer/interface designs for reliable soft interconnection and device integration.
• Conduct microstructural, chemical, mechanical, and electromechanical characterization, including electrical and reliability evaluation under bending, stretching, and cyclic deformation.
• Collaborate with interdisciplinary researchers to integrate soft-interconnect solutions into stretchable electronic devices, sensors, and system-level platforms.
• Assist in manuscript preparation, conference presentations, grant development.

Job description

The School of Materials Science and Engineering (MSE) provides a vibrant and nurturing environment for staff and students to carry out inter-disciplinary research in key areas such as Computational Materials Science, Characterisation Materials Science, Defence Composite Materials, Functional Composite Materials, Energy, Nanomaterials, Low Dimensional Materials, Biomaterials Materials, Biological Materials, Bioinspired Materials and Sustainable Materials.

For more details, please view https://www.ntu.edu.sg/mse/research .

We are seeking a highly motivated and interdisciplinary Research Fellow to develop soft, stretchable interconnect technologies for next-generation stretchable and flexible electronic devices. The role focuses on the design, fabrication, and reliability of conductive interconnects and bonded interfaces on soft, deformable substrates, with emphasis on printable conductive materials, low-temperature and photonic sintering/bonding processes, interfacial reaction and diffusion mechanisms, and electromechanical reliability under repeated deformation. The successful candidate will contribute to NTU's research in advanced materials and soft/flexible device platforms by bridging materials science, interfacial and interconnect engineering, and printed/flexible electronics.

Key Responsibilities

• Design, fabricate, and characterize stretchable and flexible interconnects and bonded joints on soft, deformable substrates using printable conductive materials and low-temperature/photonic bonding and sintering methods.
• Develop conductive inks, nanoparticle and composite material systems, and interlayer/interface designs for reliable soft interconnection and device integration.
• Conduct microstructural, chemical, mechanical, and electromechanical characterization, including electrical and reliability evaluation under bending, stretching, and cyclic deformation.
• Collaborate with interdisciplinary researchers to integrate soft-interconnect solutions into stretchable electronic devices, sensors, and system-level platforms where relevant.
• Assist in manuscript preparation, conference presentations, grant development, and reporting to funding agencies and collaborators.
• Mentor junior researchers and students where required, and support general laboratory management, procurement and equipment coordination where required.

Job Requirements

• PhD in Materials Science, Electronic/Electrical Engineering, Mechanical Engineering, Microelectronics, Chemistry, or a related discipline.
• Demonstrated research experience in flexible/stretchable electronics interconnection, printed electronics, conductive inks, soldering, interfacial joining, or low-temperature bonding of advanced materials.
• Strong background in interfacial and interconnect engineering, joint/interface design, and characterization of bonded and printed interfaces on rigid or soft substrates.
• Experience in one or more of the following areas is highly desirable: conductive ink formulation and printing, photonic/pulsed-light or low-temperature sintering, nanoparticle/nanocomposite conductive materials, flexible/stretchable device fabrication, electronic/advanced packaging, interfacial reaction and diffusion, or microstructure-property-reliability relationships in interconnects.
• Familiarity with microstructural, chemical, mechanical, and electrical/electromechanical characterization methods for materials and interfaces.
• Strong publication record in reputable journals and the ability to independently drive research tasks to completion.
• Good written and oral communication skills, with the ability to work effectively in a multidisciplinary and collaborative research environment.

We regret to inform that only shortlisted candidates will be notified.

Hiring Institution: NTU