Product Development Engineer: NPI & Process Optimization

Silicon Box Inc

Singapore

On-site

SGD 60,000 - 100,000

Full time

42 hours ago
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Job summary

Silicon Box Inc is seeking an Engineer, Product Development to lead the creation of new products and the transfer of processes into production. This role focuses on driving NPI activities, process and material development, and collaboration with cross-functional teams.

The ideal candidate has a Bachelor’s degree in a related engineering field and at least 3 years of product development experience in wafer-level FO packaging or LCD/FPD environments, with hands-on process engineering and DOE/FMEA

Qualifications

  • Bachelor’s degree in a related engineering field
  • At least 3 years in product development or NPI for wafer-level FO packaging or LCD/FPD production
  • Experience with DOE, FMEA, and 8D reports
  • Ability to coordinate with vendors and support audits

Responsibilities

  • Develop new products from customer requests and internal roadmap and transfer into production
  • Develop and qualify new materials, processes and machines, and transfer into production
  • Troubleshoot process issues and improve yield and cycle time from NPI to production
  • Establish, review and update specifications, workflow, quality and safety documentation for new products and transfer to production line
  • Coordinate and liaise with vendors on process or quality issues
  • Support customer NPI activities and internal engineering activities
  • Handle customer audits and 8D reports
  • Ad-hoc duties as assigned

Skills

DOE
FMEA
8D reports
Process engineering
Yield enhancement
Troubleshooting

Education

Bachelor’s degree in Materials Science or related field

Job description

Silicon Box Inc is seeking an Engineer, Product Development to lead the creation of new products and the transfer of processes into production. This role focuses on driving NPI activities, process and material development, and collaboration with cross-functional teams.

The ideal candidate has a Bachelor’s degree in a related engineering field and at least 3 years of product development experience in wafer-level FO packaging or LCD/FPD environments, with hands-on process engineering and DOE/FMEA

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