Semiconductor NPI Engineer: Process & Yield Leader

Silicon Box Inc; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Silicon Box Inc in Singapore is seeking a seasoned NPI Engineer to support new product introduction and ensure smooth transfer from development to high-volume manufacturing in backend semiconductor operations.

You will collaborate with R&D, Product Engineering, Quality and Supply Chain to establish, qualify and optimize processes such as lithography, wet chemistries, die prep, PnP, recon, molding, and other backend steps, while driving CAPA and continuous improvement.

Qualifications

• Bachelor's degree in EE, Materials Science, Chemical or related field.
• 5+ years in semiconductor manufacturing, backend/advanced packaging preferred.
• Experience with NPI, process development, or high-mix manufacturing is an asset.
• Familiar with lithography, wet processes, die prep, PnP, recon, molding.
• Strong root-cause analysis and problem-solving skills.
• Good communication and stakeholder management in a fast-paced environment.

Responsibilities

• Lead NPI builds from prototype to mass production.
• Drive process setup, line readiness, and material qualification.
• Collaborate with R&D, Product Eng, and Quality on manufacturability.
• Develop and review process flow, FMEA, and control plans.
• Coordinate engineering builds and resolve NPI issues.
• Support audits and documentation for product qualification.

Skills

NPI expertise

Process development

Data analysis

Root cause analysis

Six Sigma

Education

Bachelor's Degree (Electrical/Electronic or related)

Tools

MES systems

FMEA tools

Job description

Silicon Box Inc in Singapore is seeking a seasoned NPI Engineer to support new product introduction and ensure smooth transfer from development to high-volume manufacturing in backend semiconductor operations.

You will collaborate with R&D, Product Engineering, Quality and Supply Chain to establish, qualify and optimize processes such as lithography, wet chemistries, die prep, PnP, recon, molding, and other backend steps, while driving CAPA and continuous improvement.