Process Engineer: Wafer-Level Packaging

Silicon Box Inc; Singapore; On-site; SGD 48,000 - 80,000; Full time

Job summary

Silicon Box Inc is seeking a Process Engineer to develop and establish production thin film processes. You will help transfer pilot line processes to production and drive process capability and control across the line.

The role requires a Bachelor's degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering or related field, with at least 3 years’ hands-on experience in Wafer-level FO packaging or LCD/FPD production (PVD).

Qualifications

• Bachelor’s degree in a relevant engineering field.
• Hands-on process experience in Wafer-level Fanout packaging or LCD/FPD production (PVD).
• Knowledge of process engineering, process control engineering and yield optimization.

Responsibilities

• Review and accept machine buyoff, set up pilot line process and transfer to production line.
• Establish, review and update specifications, workflow, quality and safety documentation.
• Troubleshoot process issues and improve capabilities, yield and cycle time.
• Lead SPC control towards zero defects; review FMEA and Control Plans with cross-functional teams.
• Coordinate with vendors on process or quality issues; support customer NPI activities.

Skills

Process engineering

Process control engineering

Yield enhancement

SPC

DOE

8D reports

Education

Bachelor's Degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering or relevant engineering degrees

Job description

Silicon Box Inc is seeking a Process Engineer to develop and establish production thin film processes. You will help transfer pilot line processes to production and drive process capability and control across the line.

The role requires a Bachelor's degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering or related field, with at least 3 years’ hands-on experience in Wafer-level FO packaging or LCD/FPD production (PVD).