Senior Process Engineer

KEPLER COMPUTING PTE. LTD.; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

KEPLER COMPUTING PTE. LTD. in Singapore seeks an experienced semiconductor process engineer to develop, optimize, and qualify thin-film deposition processes for advanced packaging and wafer-level integration.

You will own film performance, uniformity, stress, adhesion, composition, defectivity, and integration with packaging flow. You will work with diverse teams including lithography, etch, CMP, plating, metrology, and manufacturing to transfer processes to volume production and drive process

Qualifications

• BS or MS in Materials Science, Chemical Engineering, Chemistry, Electrical Engineering, Applied Physics, or related field.
• 5+ years of semiconductor thin-film deposition or process-engineering experience.
• Hands-on experience with CVD, PECVD, PVD, ALD, or related deposition technologies.
• Strong understanding of thin-film deposition mechanisms and process chemistry.
• Experience developing and optimizing semiconductor deposition recipes.
• Strong troubleshooting skills related to chamber performance, particles, film defects, and process excursions.
• Working knowledge of DOE, SPC, process capability, and root-cause analysis.
• Experience with semiconductor film characterization and metrology.

Responsibilities

• Develop and optimize CVD, PECVD, and related thin-film deposition processes.
• Develop dielectric, passivation, barrier, liner, and other films used in advanced packaging.
• Optimize film thickness, uniformity, composition, stress, adhesion, and deposition rate.
• Establish and maintain robust deposition process windows.
• Troubleshoot particles, film non-uniformity, adhesion failures, contamination, chamber drift, and process excursions.
• Design and execute DOEs for process characterization and optimization.
• Establish SPC and process-control methodologies.
• Characterize deposited films using appropriate analytical and metrology techniques.
• Qualify new processes, materials, precursors, and equipment.
• Work closely with lithography, etch, CMP, plating, bonding, integration, metrology, and manufacturing teams.
• Support process transfer and manufacturing ramp.

Skills

Semiconductor deposition expertise

DOE & SPC proficiency

Troubleshooting skills

Process characterization

Cross-functional collaboration

Education

Bachelor's/Master's in Materials Science or related field

Tools

Deposition equipment (CVD/PECVD/PVD/ALD)

Metrology instrumentation

Job description

Role Summary

Develop, optimize, and qualify thin-film deposition processes supporting advanced packaging and wafer-level integration. The engineer will own film performance, uniformity, stress, adhesion, composition, defectivity, process stability, and integration with the overall packaging process flow.

Key Responsibilities

• Develop and optimize CVD, PECVD, and related thin-film deposition processes.
• Develop dielectric, passivation, barrier, liner, and other films used in advanced packaging.
• Optimize film thickness, uniformity, composition, stress, adhesion, and deposition rate.
• Establish and maintain robust deposition process windows.
• Troubleshoot particles, film non-uniformity, adhesion failures, contamination, chamber drift, and process excursions.
• Design and execute DOEs for process characterization and optimization.
• Establish SPC and process-control methodologies.
• Characterize deposited films using appropriate analytical and metrology techniques.
• Qualify new processes, materials, precursors, and equipment.
• Work closely with lithography, etch, CMP, plating, bonding, integration, metrology, and manufacturing teams.
• Support process transfer and manufacturing ramp.

Required Qualifications

• BS or MS in Materials Science, Chemical Engineering, Chemistry, Electrical Engineering, Applied Physics, or related field.
• 5+ years of semiconductor thin-film deposition or process-engineering experience.
• Hands-on experience with CVD, PECVD, PVD, ALD, or related deposition technologies.
• Strong understanding of thin-film deposition mechanisms and process chemistry.
• Experience controlling film thickness, uniformity, stress, adhesion, composition, and defectivity.
• Experience developing and optimizing semiconductor deposition recipes.
• Strong troubleshooting skills related to chamber performance, particles, film defects, and process excursions.
• Working knowledge of DOE, SPC, process capability, and root-cause analysis.
• Experience with semiconductor film characterization and metrology.

Preferred Qualifications

• Advanced packaging, wafer-level packaging, RDL, TSV, or heterogeneous-integration experience.
• Experience with SiN, SiO2, passivation, dielectric, barrier, or seed-layer processes.
• Hybrid-bonding process experience.
• Process-integration experience across multiple semiconductor modules.
• Experience transferring thin-film processes into volume manufacturing.