Process Engineer: Die Attach, Wire Bond & Alignment

LUMILENS; Singapore; On-site; SGD 60,000 - 90,000; Full time

Benefits offered by this job

Competitive salary and benefits

Career advancement opportunities

World-class engineering team

Collaborative and innovative work env

Job summary

Lumilens is seeking hands-on Process Engineers to support volume manufacturing ramp-up at our Bulim facility in Singapore. You will drive process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.

Responsibilities include setting up processes, reducing defects, qualifying tooling and materials for high-volume ramp, and applying SPC/DOE to ensure stable, cost-efficient

Qualifications

• Bachelor’s degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering.
• 2+ years of relevant process engineering experience in semiconductor packaging, microelectronics, SMT, or optical module manufacturing.
• Proficiency with SPC tools and structured problem-solving methodologies (8D, 5-Why, Fishbone).

Responsibilities

• Process Setup & Optimization: establish robust process windows, parameter recipes, and SOPs for production modules (DB, WB, AA, End-to-End).
• Yield & Defect Reduction: monitor line yield metrics, lead 8D root-cause analysis, and implement corrective actions.
• NPI to Mass Production: qualify new tooling, materials, and automation platforms for high-volume ramp.
• Statistical Process Control: apply SPC, DOE, FMEA, and Cpk to drive stability and cost efficiency.
• Cross-Functional Collaboration: work with Operators, Quality, and Maintenance to resolve line stops and uphold quality.

Skills

Root cause analysis

Cross-functional collaboration

Problem solving

Education

Bachelor’s degree or Diploma in Mechanical/ Electrical/ Mechatronics/ Materials Science/ Manufacturing Engineering

Tools

JMP

Minitab

GD&T

Job description

Lumilens is seeking hands-on Process Engineers to support volume manufacturing ramp-up at our Bulim facility in Singapore. You will drive process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.

Responsibilities include setting up processes, reducing defects, qualifying tooling and materials for high-volume ramp, and applying SPC/DOE to ensure stable, cost-efficient