Principal/Staff/Senior Engineer, Package Characterization - APTD

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development to lead characterization, failure analysis, and process understanding for development test vehicles and new products.

You will apply cutting-edge FA techniques, collaborate across process, reliability, and product teams, and mentor colleagues while contributing to continuous improvement and technology development in a fast-paced environment.

Qualifications

• PhD with ≥5 years, or Master's degree with ≥7 years, or Bachelor's degree with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
• Semiconductor industry experience in product, packaging or test engineering and complex products.

Responsibilities

• Conduct Electrical and PFA Characterization
• Perform electrical fault analysis to pin-point hotspots on advanced packages
• Perform precision cross-section on hotspot location using Plasma FIB
• Perform die-stacked characterization using a combination of sample prep tools including Plasma FIB
• Understand the various PFA techniques available for de-processing failures
• Understand assembly and test process for advanced packaging technology
• Establish best known methods for de-processing of advanced packaging
• Provide Data Analysis
• Communicate with Internal/External Groups
• Document failure analysis techniques used to isolate failure for other groups
• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs
• Provide Technical Expertise
• Conduct TMO training and FA certification
• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.
• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network
• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap
• Maintain Equipment
• Coordinate calibrations (external to Micron)
• Procure parts as needed
• Coordinate host vendors to support equipment repair
• Manage Laboratory
• uphold Micron safety standards and compliance

Skills

Analytical skills

Communication & leadership

Independent work

Cross-functional collaboration

Education

PhD +5 years / MSc +7 yrs / Bachelors +10 yrs in EE / materials / physics

Tools

SEM

EDX

FIB

TEM

AFM

FTIR

XPS

X-ray

CSAM

Ion Milling

delayering

decapsulation

Job description

Role Summary:

As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Main Responsibilities:

• Conduct Electrical and PFA Characterization
• Perform electrical fault analysis to pin-point hotspots on advanced packages
• Perform precision cross-section on hotspot location using Plasma FIB
• Perform die-stacked characterization using a combination of sample prep tools including Plasma FIB.
• Understand the various PFA techniques available for de-processing failures
• Understand assembly and test process for advanced packaging technology
• Establish best known methods for de-processing of advanced packaging
• Provide Data Analysis
• Understand backend test flows, qualification methodologies and be able to pull relevant information
• Communicate with Internal/External Groups
• Document failure analysis techniques used to isolate failure for other groups
• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs
• Provide Technical Expertise
• Conduct TMO training and FA certification
• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.
• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.
• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap
• Maintain Equipment
• Coordinate calibrations (external to Micron)
• Procure parts as needed
• Coordinate host vendors to support equipment repair
• Manage Laboratory
• Consistently upholds and promotes Micron's safety standards, ensuring all activities are conducted in a safe and compliant manner.
• Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.
• To manage the exhaust and scrubber systems of the FA Lab.
• To maintain records and procedures as per Micron GOPs
• AI Responsibilities:
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Candidate Profile

Minimum Required Qualifications:

• PhD with ≥5 years, or Master's degree with ≥7 years, or Bachelor's degree with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
• Semiconductor industry working on complex products, preferably in product, packaging or test engineering.

Must Have Technical Skills:

• 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.
• Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.

Must Have Soft Skills:

• Strong analytical and problem-solving capabilities.
• Outstanding communication, leadership, and stakeholder management skills.
• Ability to work independently and collaboratively in a fast-paced environment.
• Ability to work cross-functionally with process, equipment, and reliability teams.

AI Requirements:

• Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes.

Embody Micron's core values:

• People - Respect, develop, and empower others
• Innovation - Drive continuous improvement and breakthrough thinking
• Tenacity - Show grit and determination
• Collaboration - Build trust and foster teamwork
• Customer Focus - Deliver excellence and value
• Speed - Act with purpose and set the pace