Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer Singapore, Singapore Posted 11 hours ago

Micron Technology, Inc.; Singapore; Hybrid; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. seeks a Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer to lead electrical characterization and failure analysis for HBM products within the DEMQRA group.

You will distinguish package- vs device-related failures, interpret test results, and apply AI to improve FA efficiency. You will analyze failed components from reliability tests, coordinate with multiple groups for CSAM/PFA/FO, and provide technical support and training to lab users.

Qualifications

• 5+ years of experience in semiconductor field.
• Knowledge of DRAM operation, fabrication process and semiconductor device physics.
• Familiarity with failure analysis, debugging, advanced packaging, wafer testing, and module testing.

Responsibilities

• Analyze failed components from reliability testing and categorize electrical failures.
• Coordinate with PYE, CSAM, FO, PFA, Product Engineering and Package Reliability teams.
• Troubleshoot hardware and software, repair or coordinate repair of equipment, and deploy FA software.

Skills

DRAM operation

Failure analysis

Troubleshooting

Communication skills

Unix/DFII/Cadence/uMate familiarity

Equipment troubleshooting

Education

Bachelor’s degree in Electrical/Electronics/Computer Engineering

Master’s degree in Electrical/Electronics/Computer Engineering

Tools

uMate

Merlin

Mongoose SM3

Prober

CAD/layout tools

Job description

## Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) EngineerSingapore, SingaporeApply NowFind out how well you match with this jobJob ID: JR111721**Our vision is to transform how the world uses information to enrich life for all.**Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.**Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer****Job Description**As a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology, Inc., you will be responsible for the electrical characterization and electrical failure analysis (EFA) of all HBM products. You will need to distinguish whether it is package or device related failures. Preferably, you are equipped with knowledge of DRAM functionality, process, test program and device necessary for making solid judgment. You will also use a variety of test tools including the uMate tester, Merlin, Mongoose SM3, Prober, CAD layout tool, and a variety of technical drawings and schematics to perform detailed characterization on HBM products. You will record and categorize failures in order to determine failure mechanisms and characteristics. In this role, you will communicate with various engineering groups, assist lab users with equipment setup and interpretation of data, and maintain critical EFA knowledge database. You will also be expected to apply AI to seek ways to improve the EFA process in order to reduce test time, increase throughput, and increase failure mechanism assignment accuracy and consistency.**You will:****Analyze Failed Components from Reliability Testing*** Interpret historical tests results* Adjust timing/level/testmode/code/temp to find out the sensitivities of failures for array fails* Perform visual inspection to identify physical defects* Utilize schematics/layouts/process to recognize abnormalities* Document failed conditions and test results* Categorize electrical failures* Communicate results* Coordinate next level analysis to various groups including PYE (Product Yield Enhancement) for CSAM (C-mode scanning acoustic microscope)/functional open (FO)/PFA (Physical Failure Analysis), Product Engineering and Package Reliability.* Identify and communicate new or unusual results (electrical signals)**Respond to Equipment Issues*** Understand test software and hardware configurations* Troubleshoot hardware issues* Identify and report software and hardware issues* Repair or coordinate repair of equipment* Configure and upgrade test equipment* Develop and deploy failure analysis (FA) software**Provide Technical Support and Conduct Training*** Assist lab users with equipment setup* Teach operation of equipment* Conduct on-the-job training (OJT) for new hires and transfers* Provide data interpretation* Suggest failure root cause* Provide suggestions for further analysis* Introduce new users to basic DRAM functionality/process/device**Perform Engineering Requests and Supplemental Tasks*** Submit package level physical failure analysis (PFA)* Provide FA for other groups as requested (RMA, Module)* Determine engineering test requirements* Execute request and experiments* Summarize test results and provide feedback* Create repair converters**Manage Failure Analysis (FA) Information*** Create and maintain specific FA database* Track FA data* Identify false failures* Analyze and summarize data**Perform Quality/Reliability request and review*** Perform review on test time reduction requests* Perform review on Design/Marketing datasheet requests* Perform review on Modify Qual requests* Perform review on Material Review Board (MRB)* Perform review on Process of Record Review Board (PORRB)* Perform review on customer reports/data**Education:*** Required: Bachelor’s degree in Electrical / Electronics/ Computer Engineering* Desired: Master’s Degree in Electrical / Electronics/ Computer Engineering**Required Qualifications:*** 5+ years of experience in semiconductor field* Knowledge of DRAM operation, fabrication process and semiconductor device physics* Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer testing, component testing and module testing concept and flow.* Strong troubleshooting skill* Good organizational skills and sharp attention to detail* Good written and oral communication skills* Efficient computer skills* Knowledge of the DRAM fabrication process/test program/functionality* Familiarity with Unix, DFII/Cadence, and/or uMate preferred* Ability to work independently or in a group environment* Basic understanding of electrical equipment* Ability to use the analytical tools provided on the various test equipment, such as uMate, Curve Tracer, or Oscilloscope* Proficiency in applying AI/AI-enabled tools to improve engineering workflows, with a willingness to adopt new AI capabilities