Principal Engineer — Advanced Packaging Systems

ASM; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

ASM is hiring engineers across multiple experience levels to join our Advanced Packaging team. You’ll work at the intersection of cutting edge technology, engineering, field operations and customer environments, ensuring our equipment performs reliably from concept through high‑volume manufacturing.

You will contribute to design, development and troubleshooting of semiconductor systems, drive automation, lead or support NPI, and collaborate with global teams.

Qualifications

• Bachelor’s, Master’s or PhD in Engineering required.
• Experience in semiconductor equipment or complex technical environments.
• Knowledge of CE, NFPA, Semi S2‑95 and related standards for semiconductor manufacturing equipment.
• Strong problem‑solving mindset with system‑level thinking.
• Willingness to travel internationally (~25–50%).

Responsibilities

• Contribute to design and development of semiconductor systems, including equipment selection, process controls, and automation integration.
• Manage project timelines, budgets, and resources while ensuring safety and quality standards.
• Collaborate with cross‑functional teams in manufacturing, operations, and quality to align goals and deliverables.
• Provide technical support and troubleshooting for equipment and automation systems, driving root cause analysis and resolution.
• Own BOM release and maintenance, ensuring accurate documentation and reporting for stakeholders.
• Drive continuous improvement initiatives and stay current with industry trends and emerging technologies.
• Prepare comprehensive design documentation for manufacturing and testing of prototypes and production products.
• Act as a system‑level technical expert, supporting complex semiconductor equipment in development labs and customer fabs.
• Diagnose and resolve advanced system, hardware, and process issues, including escalations beyond standard support.
• Drive RCCA and implement sustainable solutions across tools, sites, and product lines.
• Support new product introduction (NPI), including early builds, lab validation and ramp to high‑volume manufacturing.
• Lead or support first‑in‑fab (Alpha / Beta) deployments — installation, start‑up and qualification.
• Translate field and customer feedback into design, performance, and reliability improvements.
• Contribute to yield improvement, tool performance, and uptime in demanding fab environments.
• Develop and share best practices, technical documentation, and global standards.
• Collaborate with hardware, software, controls, and process engineering teams.
• Lead / Support global initiatives, mentor engineers and represent ASM in customer‑facing teams.

Skills

Problem solving

System thinking

DOE / data analysis

Communication

Global collaboration

Travel readiness

Education

Bachelor’s, Master’s or PhD in Engineering (Mechanical, Electrical, Chemical, Systems, or similar)

Tools

CE standards

NFPA standards

Semiconductor industry standards

Job description

ASM is hiring engineers across multiple experience levels to join our Advanced Packaging team. You’ll work at the intersection of cutting edge technology, engineering, field operations and customer environments, ensuring our equipment performs reliably from concept through high‑volume manufacturing.

You will contribute to design, development and troubleshooting of semiconductor systems, drive automation, lead or support NPI, and collaborate with global teams.