Senior Engineer, Process Engineering

ASM; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

ASM is seeking a Senior Process Engineer in Advanced Packaging to translate research into scalable semiconductor process technologies. You will work with engineers and scientists to develop and optimize processes, implement DOE-based experiments, and document results for transfer to manufacturing.

In this industrial R&D role, you will contribute to evaluating film quality, reliability, and performance, while collaborating across R&D, process engineering, and applications teams to drive

Qualifications

• PhD required in a relevant field.
• Hands-on research with thin-film deposition processes (ALD, CVD, PECVD, or PVD).
• Strong experimental background including designing experiments and analyzing data.
• Excellent written and verbal communication skills.
• Curiosity, initiative and motivation to apply research in industry.
• Strong understanding of electro/mechanical equipment and software systems.
• Experience with materials characterization methods (SEM, TEM, XRD, ellipsometry).
• Familiarity with statistical methods, DOE tools, or data modeling.

Responsibilities

• Contribute to R&D and optimization of semiconductor processes for Advanced Packaging (ALD, PECVD, PVD, surface prep).
• Design, execute, and analyze DOE-based experiments with guidance from senior engineers.
• Characterize films for quality, reliability, and performance.
• Analyze experimental data and document results in technical reports and presentations.
• Collaborate with cross-functional teams across R&D, process engineering, and applications.
• Support troubleshooting of process or equipment in lab and pilot environments.
• Participate in technology reviews and suggest process improvements.
• Learn industry best practices for transitioning processes from development to manufacturing.

Skills

Thin-film deposition experience

Experimental design

Data analysis

Written and verbal communication

Curiosity and initiative

Electro/mechanical equipment knowledge

Statistical methods / DOE

Materials characterization knowledge

Education

PhD in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering or related field

Tools

SEM

TEM

XRD

Ellipsometry

Job description

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Job's mission

As a Senior Process Engineer in Advanced Packaging, you will bring your research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies.

What You Will Be Working On

• Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies.
• Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts.
• Perform materials and process characterization to evaluate film quality, reliability, and performance.
• Analyze experimental data and clearly document results in technical reports and internal presentations.
• Collaborate with cross-functional teams across R&D, process engineering, and applications.
• Support troubleshooting of process or equipment issues in laboratory and pilot environments.
• Participate in technology reviews and contribute ideas to process improvement and innovation initiatives.
• Learn industry best practices for transitioning processes from development into customer and manufacturing environments.

What We Are Looking For

• PhD in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering or related field.
• Hands-on research experience with thin-film deposition processes such as ALD, CVD, PECVD, or PVD.
• Strong experimental background, including designing experiments and analyzing complex data sets.
• Solid problem-solving and analytical skills, with a structured approach to research challenges.
• Clear written and verbal communication skills, with the ability to explain technical concepts to diverse audiences.
• Curiosity, initiative, and motivation to apply academic research in an industrial setting.
• Strong understanding of electro/mechanical equipment and software systems

What Sets You Apart

• Research experience related to advanced packaging, interconnects, or semiconductor manufacturing
• Familiarity with statistical methods, DOE tools, or data modeling techniques.
• Experience with materials characterization methods such as SEM, TEM, XRD, or ellipsometry.
• Exposure to cross-disciplinary or collaborative research environments.
• Interest in long-term growth within semiconductor technology development and process engineering.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.