Physical Failure Analysis Engineer / Senior Engineer (PFA)

wintech nano-technology services pte. ltd.; Singapore; On-site; SGD 45,000 - 67,000; Full time

Benefits offered by this job

Night shift allowance

Shift rotation

Job summary

wintech nano-technology services pte. ltd. in Singapore seeks a detail-oriented PFA Engineer (or Senior Engineer) to support semiconductor lab operations.

You will perform advanced failure analysis using FIB, SEM, and EBSD, and prepare TEM lamellae, contributing to root-cause investigations. The role requires practical experience or strong training in EBSD, EBSD analysis, data interpretation, and reporting findings to clients.

Qualifications

• Diploma, Bachelor’s or Master’s degree in Engineering (Electrical/Electronic, Materials Science, or related).
• Hands-on experience with FIB, SEM, and EDX is highly desirable; EBSD analysis knowledge is advantageous.
• Solid understanding of semiconductor device physics and manufacturing processes.

Responsibilities

• Perform high-precision physical failure analysis using FIB, SEM, and EDX; EBSD analysis for crystallographic characterization.
• Prepare TEM lamella using FIB lift-out techniques and document findings in reports.
• Compile comprehensive analytical reports detailing FIB-SEM, SEM-EDX and EBSD results for client delivery.
• Document and update SOPs, training modules, and certification specifications for failure analysis workflows.
• Participate in R&D of new failure analysis techniques and evaluate emerging technologies.
• Work in a rotational day/night shift system.

Skills

FIB

SEM

EDX

EBSD analysis

Laboratory independence

Night shift adaptability

Education

Bachelor's or higher in Engineering

Tools

EBSD software

TEM lamella preparation

SOP documentation

Job description

Role Overview

We are seeking a detail-oriented and technically skilled PFA Engineer (or Senior Engineer) to join our team. This role is central to our laboratory operations, focusing on advanced micro-structural analysis and sample preparation to support the semiconductor and electronics industries.

Key Responsibilities

• Advanced Analysis: Perform high-precision physical failure analysis using FIB (FocusedIon Beam), SEM, and EBSD (Electron Backscatter Diffraction) techniques.
• Crystallographic Characterization: Utilize EBSD to analyze grainorientation, texture, and phase identification to support root-cause failureinvestigations.
• Sample Preparation: Prepare high-quality TEM (Transmission Electron Microscopy) lamella using specialized FIB-related lift-out techniques.
• Reporting: Compile comprehensive analytical reports detailing FIB-SEM, SEM-EDSand EBSD findings for client delivery.
• Standardization: Document and update Standard Operating Procedures (SOPs), trainingmodules, and certification specifications for failure analysis workflows.
• Innovation: Participate in the research and development of new failure analysis techniques and evaluate emerging technologies to maintain lab excellence.
• Shift Operations: Work within a rotational shift system (Quarterly Day/Night shiftrotation).

Requirements

• Education: Diploma, Bachelor’s Degree, or Master’s Degree in Engineering(Electrical/Electronic, Materials Science, or a related discipline).
• Technical Skills: Hands-on experience with FIB, SEM, and EDX is highly desirable. Prior experience or theoretical knowledge of EBSD analysis and data interpretation is a significant advantage.
• Industry Knowledge: A solid understanding of semiconductor device physics and manufacturing processes.
• Soft Skills: A keen learner with the ability to work independently in a fast-paced laboratory environment.
• Flexibility: Must be able to perform night shift work with flexible working periods.
• Experience Level: Open to Fresh Graduates for the Engineer level; experienced candidates will be considered for the Senior Engineer role.

Benefits

• Competitive monthly salary ($4,000 – $6,000).
• Highly attractive shift allowance provided for night shift rotations.