Packaging Engineering Intern — Sustainable, Data-Driven

Hewlett Packard Enterprise

Singapore

On-site

SGD 20,000 - 27,000

Full time

4 days ago
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Job summary

Hewlett Packard Enterprise (HP) invites college interns to join the Packaging Engineering team in Singapore for a 5–6 month full-time internship starting January 2027. You will work under experienced packaging engineers to design and validate packaging solutions for Ink Supplies products, participate in testing, and help with documentation and cross-functional collaboration.

Ideal candidates are pursuing a relevant engineering degree, have strong analytical skills, familiarity with CAD tools,

Qualifications

  • Pursuing Bachelor's or Master's in Packaging, Mechanical, Industrial, Manufacturing Engineering, Materials Science or related.
  • Able to commit for 5-6 months full-time internship starting January 2027.
  • Previous internship, academic project, or lab experience in packaging, product development, manufacturing, or testing.
  • Basic understanding of packaging design principles, materials, and manufacturing processes.
  • Interest in sustainability and environmentally responsible packaging.

Responsibilities

  • Support design and development of packaging solutions for Ink Supplies products.
  • Assist in creating packaging concepts, specifications, drawings, and documentation.
  • Participate in packaging validation and qualification activities including testing for form, fit, function, shock, vibration, compression and environmental performance.
  • Collect, analyze, and summarize test data; prepare reports for engineering review.
  • Support cost reduction, sustainability, and efficiency initiatives.
  • Assist with qualification builds, manufacturing trials, and packaging implementation.

Skills

Strong analytical
Data analysis
MS Office
Collaborative

Education

Bachelor's/Master's in Packaging/Mechanical/Industrial/Manufacturing Engineering or related

Tools

SolidWorks
Creo
NX
AutoCAD
TOPS

Job description

Hewlett Packard Enterprise (HP) invites college interns to join the Packaging Engineering team in Singapore for a 5–6 month full-time internship starting January 2027. You will work under experienced packaging engineers to design and validate packaging solutions for Ink Supplies products, participate in testing, and help with documentation and cross-functional collaboration.

Ideal candidates are pursuing a relevant engineering degree, have strong analytical skills, familiarity with CAD tools,

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